editor's blog
Subscribe Now

An Optical MEMS Reference Process

A while back Micralyne announced a MEMS reference process. There are a few of these running around: attempts to achieve – or at least grasp at – a standard process that can address a wide range of MEMS devices.

Most of Micralyne’s processes are confidential, per their customer relationships, in typical MEMS style. What they did here was to take a “neutral” improved version of what they do well and open it up. They’re not sure that customers will simply line up and use that process in high-volume production outright, but at the very least it’s a conversation starter and a way for them to show their capabilities without divulging secrets.

Micralyne’s strength is primarily optical MEMS: mirrors and comb drives and such. Those feature large in their process, but, in order to be a bit more general, they added some inertial devices, like a 2-axis (but not a 3-axis) accelerometer and a gyro, as well as some biomedical devices.

It’s a two-wafer process (plus handles); cavities are etched into the base wafer and the top wafer; the top wafer is inverted and fusion-bonded to the bottom wafer, after which the top-wafer handle is removed. From the top, release is performed and then metal is laid down. This metal step pertains in particularly to giving mirrors a nice reflective surface.

As a complete aside, in the discussion of their optical capabilities, there was repeated mention of “hitless” functionality with respect to the mirrors. I actually had a hard time finding out what this meant, and a conversation with Micralyne helped clarify. For any of you who are, like me, not steeped in optical, this is a way of changing optical routing in an optical switch without interfering with other channels.

It’s actually a pretty simple concept. Below I show a scenario with various fibers being routed to various other fibers via the gold mirrors. In particular, fiber 3 routes to fiber 1 (moving bottom to top). Let’s say we want to reroute that so that fiber 3 now routes to fiber 6. If we just move the mirror across, then the light stream from fiber three will interfere with all of the other receiving channels as it scans across (which I’ve tried to illustrate on the right, with the stars indicating interference as the beam moves; at the particular moment shown, it’s made it as far as target fiber 4 on its way to 6).

Hitless_switching_1.png

So the hitless idea is that you simple tilt the mirror in the orthogonal direction first so that it’s no longer targeting the receiving fibers. You can then sweep it across to the new target; the light is now moving under the other beams and doesn’t interfere. Once over in the new position, you then bring the beam back up to its normal working position and the connection is made (with no disturbance to the others).

Hitless_switching_2.png

You can find more info in their release and whitepapers.

Leave a Reply

featured blogs
May 24, 2022
Today is going to be my monthly update. This normally runs on the last Friday of the month, but that's a Cadence Global Recharge Day, so we will all be off. For various other reasons, I need to... ...
May 20, 2022
I'm very happy with my new OMTech 40W CO2 laser engraver/cutter, but only because the folks from Makers Local 256 helped me get it up and running....
May 19, 2022
Learn about the AI chip design breakthroughs and case studies discussed at SNUG Silicon Valley 2022, including autonomous PPA optimization using DSO.ai. The post Key Highlights from SNUG 2022: AI Is Fast Forwarding Chip Design appeared first on From Silicon To Software....
May 12, 2022
By Shelly Stalnaker Every year, the editors of Elektronik in Germany compile a list of the most interesting and innovative… ...

featured video

Synopsys PPA(V) Voltage Optimization

Sponsored by Synopsys

Performance-per-watt has emerged as one of the highest priorities in design quality, leading to a shift in technology focus and design power optimization methodologies. Variable operating voltage possess high potential in optimizing performance-per-watt results but requires a signoff accurate and efficient methodology to explore. Synopsys Fusion Design Platform™, uniquely built on a singular RTL-to-GDSII data model, delivers a full-flow voltage optimization and closure methodology to achieve the best performance-per-watt results for the most demanding semiconductor segments.

Learn More

featured paper

Reduce EV cost and improve drive range by integrating powertrain systems

Sponsored by Texas Instruments

When you can create automotive applications that do more with fewer parts, you’ll reduce both weight and cost and improve reliability. That’s the idea behind integrating electric vehicle (EV) and hybrid electric vehicle (HEV) designs.

Click to read more

featured chalk talk

Solutions for Heterogeneous Multicore

Sponsored by Siemens Digital Industries Software

Multicore processing is more popular than ever before but how do we take advantage of this new kind of processing? In this episode of Chalk Talk, Jeff Hancock from Siemens and Amelia Dalton investigate the challenges inherent in multicore processing, the benefits of hypervisors and multicore frameworks, and what you need to consider when choosing your next multicore processing solution.

Click here for more information about Multicore Enablement: Enabling today’s most advanced MPSoC systems