editor's blog
Subscribe Now

New Sensor Parameter Standard

Early this year we took a look at MEMS standards (or the need therefor), and one of the active efforts involved unifying sensor parameters and data sheets so that users could compare and combine different sensors from different companies – a challenging task at present.

Well, that effort has now yielded some results. The “Sensor Performance Parameter Definitions” document has been released under the auspices of the MEMS Industry Group (MIG). The effort itself was led by Intel and Qualcomm, with input from a number of different sensor players.

While many such standards documents start with a limited scope and just can’t stop, a quick look at the table of contents suggests that hasn’t happened here. The bulk of the document is simply a set of definitions for parameters for different sensors. It is augmented by helpful lists of terms and acronyms, symbols and equations, and measurement conversions.

The sensors covered by the document are:

  • Accelerometers
  • Magnetometers
  • Gyroscopes
  • Pressure Sensors
  • Humidity Sensors
  • Temperature Sensors
  • Ambient Light Sensors
  • Proximity Sensors

This seems to cover all of the Windows HID-required sensors (since inclinometers and orientation sensors are typically fused versions of the above) except for GPS.

Each sensor type has its own parameters. For example, the following parameters are defined for accelerometers:

  • Full Scale Range
  • Digital Bit Depth
  • Zero-g Offset
  • Zero-g Offset Temperature Coefficient
  • Sensitivity
  • Sensitivity Temperature Coefficient
  • Noise
  • Current Consumption
  • Output Data Rate (ODR)
  • Filter -3dB Cutoff
  • Internal Oscillator Tolerance
  • Cross-Axis Sensitivity
  • Integral Non-Linearity
  • Transition Time
  • Data Ready Delay

For each parameter, the following information is provided:

  • Any aliases or other names for the parameter
  • A definition
  •  Conditions under which the parameter is specified (typically more than one)
  • Distribution (e.g., minimum/typical/maximum)

Various timing diagrams and other graphs are used to illustrate the parameters.

And that’s pretty much all there is to it.  A modest 60 pages (with lots of whitespace, easy to read). As promised, no more, no less.

You can find more on the announcement in their release; the document is available for download on the MIG website (you’ll need to provide your info).

Leave a Reply

featured blogs
Jun 18, 2021
It's a short week here at Cadence CFD as we celebrate the Juneteenth holiday today. But CFD doesn't take time off as evidenced by the latest round-up of CFD news. There are several really... [[ Click on the title to access the full blog on the Cadence Community sit...
Jun 17, 2021
Learn how cloud-based SoC design and functional verification systems such as ZeBu Cloud accelerate networking SoC readiness across both hardware & software. The post The Quest for the Most Advanced Networking SoC: Achieving Breakthrough Verification Efficiency with Clou...
Jun 17, 2021
In today’s blog episode, we would like to introduce our newest White Paper: “System and Component qualifications of VPX solutions, Create a novel, low-cost, easy to build, high reliability test platform for VPX modules“. Over the past year, Samtec has worked...
Jun 14, 2021
By John Ferguson, Omar ElSewefy, Nermeen Hossam, Basma Serry We're all fascinated by light. Light… The post Shining a light on silicon photonics verification appeared first on Design with Calibre....

featured video

Reduce Analog and Mixed-Signal Design Risk with a Unified Design and Simulation Solution

Sponsored by Cadence Design Systems

Learn how you can reduce your cost and risk with the Virtuoso and Spectre unified analog and mixed-signal design and simulation solution, offering accuracy, capacity, and high performance.

Click here for more information about Spectre FX Simulator

featured paper

An FAQ about the Matter connectivity standard from TI

Sponsored by Texas Instruments

Formerly Project CHIP, Matter is a new connectivity standard that runs on Thread and Wi-Fi network layers to provide a unified application layer for connected devices. Read this article to discover how you can get started with Matter and TI.

Click to read more

Featured Chalk Talk

Protecting Circuitry with eFuse IC

Sponsored by Mouser Electronics and Toshiba

Conventional fuses are rapidly becoming dinosaurs in our electronic systems. Finally, there is circuit protection technology that doesn’t rely on disposable parts and molten metal. In this episode of Chalk Talk, Amelia Dalton chats with Jake Canon of Toshiba about eFuse - a smart solution that will get rid of those old-school fuses once and for all.

Click here for more information about Toshiba efuses