editor's blog
Subscribe Now

3D-IC Planning

During Cadence’s recent CDNlive event, I had a discussion with Kevin Rinebold to talk about 3D-IC planning and design. Actually, it’s more than that, covering all of the multi-die/package combinations like system-in-package (SiP), complex PC boards, and interposer-based solutions. The basic issue is that it’s becoming increasingly difficult to separate die design from board/package design; you may have to plan both together.

Said another way, what used to be board design duties have encroached on die design as packages have started to look more and more like micro-PCBs. The “lumpiness” of old-fashioned design is giving way to a more distributed approach as the “lumps” interact in non-lumpy ways.

Cadence’s approach splits the process in two: planning and implementation. Their focus during our discussion was the planning portion. Why split this part of the process out? Because it’s generally being done by the packaging people (“OSATs”), not the silicon people. So the OSATs will do high-level planning – akin to floorplanning on a die (and may actually involve floorplanning on a substrate).

They hand their results to the implementation folks via an abstract file and, possibly, some constraints to ensure that critical concerns will be properly addressed during design. The abstract file isn’t a view into a database; it is a one-off file, so if changes are made to the plan, new abstracts can (or should) be generated.

Cadence says the key to this is their OrbitIO tool, from their Sigrity group. It allows mechanical planning – things like ensuring that power and ground pins are located near their respective planes. They can also do some power IR drop analysis, although more complete electrical capabilities will come in the future.

There’s one other reason why the planning and implementation are done with completely different tools (mediated by the abstract file): OSATs tend to work on Windows machines, while designers tend to work on Linux machines. No, this is not an invitation to debate. (Oh, wait, Apple isn’t involved in this comparison… OK… never mind…)

Leave a Reply

featured blogs
Sep 23, 2020
CadenceLIVE 2020 India, our first digital conference held on 9-10 September and what an event it was! With 75 technical paper presentations, four keynotes, a virtual exhibition area, and fun... [[ Click on the title to access the full blog on the Cadence Community site. ]]...
Sep 22, 2020
If you are at all interested in digital signal processing (DSP), then the DSP Online Conference is the place to '€œsee and be seen'€ -- register now before all the good seats are snapped up!...
Sep 22, 2020
I am a child of the 80s.  I grew up when the idea of home computing was very new.  My first experience of any kind of computer was an Apple II that my Dad brought home from work. It was the only computer his company possessed, and every few weeks he would need to cr...
Sep 18, 2020
[From the last episode: We put the various pieces of a memory together to show the whole thing.] Before we finally turn our memory discussion into an AI discussion, let'€™s take on one annoying little detail that I'€™ve referred to a few times, but have kept putting off. ...

Featured Video

Product Update: Family of DesignWare Ethernet IP for Time-Sensitive Networking

Sponsored by Synopsys

Hear John Swanson, our product expert, give an update on Synopsys’ DesignWare® Ethernet IP for Time-Sensitive Networking (TSN), which is compliant with IEEE standards and enables predictable guaranteed latency in automotive ADAS and industrial automation SoCs.

Click here for more information about DesignWare Ethernet Quality-of-Service Controller IP

Featured Paper

4 audio trends transforming the automotive industry

Sponsored by Texas Instruments

The automotive industry is focused on creating a comfortable driving experience – but without compromising fuel efficiency or manufacturing costs. The adoption of these new audio technologies in cars – while requiring major architecture changes – promise to bring a richer driving and in-car communication experience. Discover techniques using microphones, amplifiers, loudspeakers and advanced digital signal processing that help enable the newest trends in automotive audio applications.

Click here to download the whitepaper

Featured Chalk Talk

Automotive MOSFET for the Transportation Market

Sponsored by Mouser Electronics and Infineon

MOSFETS are critical in automotive applications, where long-term reliability is paramount. But, do we really understand the failure rates and mechanisms in the devices we design in? In this episode of Chalk Talk, Amelia Dalton sits down with Jeff Darrow of Infineon to discuss the role of MOSFETS in transportation, solder inspection, qualification.

Click here for more information about Infineon Technologies OptiMOS™ 5 Power MOSFETs