editor's blog
Subscribe Now

Tying Up the Missing Link

Methodics’s ProjectIC platform is intended to help manage large design projects by keeping the numerous different files associated with the design (so-called “views” – the unbranded sort, whose branded counterpart we’ll discuss in a couple days) in sync with each other. These may include RTL source files, schematic views, analysis runs, layout, and other design artifacts. They’re tied to each other by dependencies that Methodics builds.

One thing they haven’t had completely covered is test. They’ve handled analog test, but not digital. This was the motivation of their recent purchase of Missing Link, which, in particular, has a design management infrastructure that includes digital test and regression.

So Methodics will now be building in the dependencies to those artifacts as well. You can find more detail on the companies in their press release.

Leave a Reply

featured blogs
Mar 28, 2024
'Move fast and break things,' a motto coined by Mark Zuckerberg, captures the ethos of Silicon Valley where creative disruption remakes the world through the invention of new technologies. From social media to autonomous cars, to generative AI, the disruptions have reverberat...
Mar 26, 2024
Learn how GPU acceleration impacts digital chip design implementation, expanding beyond chip simulation to fulfill compute demands of the RTL-to-GDSII process.The post Can GPUs Accelerate Digital Design Implementation? appeared first on Chip Design....
Mar 21, 2024
The awesome thing about these machines is that you are limited only by your imagination, and I've got a GREAT imagination....

featured video

We are Altera. We are for the innovators.

Sponsored by Intel

Today we embark on an exciting journey as we transition to Altera, an Intel Company. In a world of endless opportunities and challenges, we are here to provide the flexibility needed by our ecosystem of customers and partners to pioneer and accelerate innovation. As we leap into the future, we are committed to providing easy-to-design and deploy leadership programmable solutions to innovators to unlock extraordinary possibilities for everyone on the planet.

To learn more about Altera visit: http://intel.com/altera

featured chalk talk

Achieving High Power Density with IGBT and SiC Power Modules
Sponsored by Mouser Electronics and Infineon
Recent trends in the inverter market have made high power density, scalability, and ease of assembly more important than ever before. In this episode of Chalk Talk, Amelia Dalton and Abraham Markose from Infineon examine how Easy & Econo power modules from Infineon can help solve common inverter design requirements. They explore the benefits and construction of these modules and how you can take advantage of them in your next design.
May 19, 2023
34,600 views