editor's blog
Subscribe Now

Graychip Alternatives

Chips that have reached, or are approaching, their end of life have been a perennial problem for systems makers for years. And the solutions have varied over time, with lifetime buys or the selling of the chip design to another company specializing in keeping older technology alive for longer than the original maker is interested in.

I remember seeing an email years ago from a Japanese customer that had decided they needed more of a long-obsolete chip. Their simple request was, “Can you please open up that fab again and make us some more? Kthanxbai.” The expectation was that a customer would never be told, “No,” and that we would re-open the old line, re-install the long-gone process, and make them some more chips. Now… I’m pretty customer-centric, but come on guys… But I digress.

RFEL has announced a new variant on substituting TI’s aging Graychip low-level DSP products: they reproduce the behavior in an FPGA. And there’s some nuance here: it’s actually not correct to say that it’s the behavior they duplicate – it’s the parameters. They may actually use a different algorithm, but they develop it using Matlab, and they use the Matlab models to prove to the customer that the parameters match those of the original Graychip devices.

Of course, this isn’t a pin-for-pin drop-in production replacement; it tends to get worked into a revision when it’s not worth completely re-architecting old functionality that works. It can, however, be a cost reduction.

They support both Altera and Xilinx, although they can’t use the same design for both… of course…

You can find more info in their release

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Package Evolution for MOSFETs and Diodes
Sponsored by Mouser Electronics and Vishay
A limiting factor for both MOSFETs and diodes is power dissipation per unit area and your choice of packaging can make a big difference in power dissipation. In this episode of Chalk Talk, Amelia Dalton and Brian Zachrel from Vishay investigate how package evolution has led to new advancements in diodes and MOSFETs including minimizing package resistance, increasing power density, and more! They also explore the benefits of using Vishay’s small and efficient PowerPAK® and eSMP® packages and the migration path you will need to keep in mind when using these solutions in your next design.
Jul 10, 2023
32,434 views