editor's blog
Subscribe Now

ARM’s Top Three Cellular Trends

At ARM’s recent TechCon event, I heard from James Bruce, their lead mobile strategist, who gave his views on the three trends he sees underway on the mobile front.

The first is the continued evolution of the smartphone; no surprise there. These are the machines that are expected to replace your laptop someday. At around $600, they’ll focus on features and performance. (And, addressing my kvetch comment following Jim’s article at the end of that link, yes, evidently docking stations are being prepared. He wasn’t able to share any names. I’m just glad I won’t be forced to thumb future articles on a phone.)

The second is the firming up of an entry-level smartphone category, in the $80 range. What will the user give up for that $520? Well, most of the costs are in the screen, the sensors, and in the technology required to make a phone super thin and super low-power. So this category would do much of what the super-smartphone would do, only slower, with less memory, fewer sensors, a larger battery, and lower-quality mechanics. He describes it as being like a 2009-10 smartphone, only cheaper.

The third is the emergence of LTE (long-term evolution) for increased capacity (roughly double) and consistent data rates. It also brings MIMO (multiple in/out) technology to improve reception in harsh urban environments.

Of course, there’s inconsistency in marketing LTE as a 3G or 4G technology. In the US, it’s called 4G because, well, because we like to market things as better than they are whenever we can get away with it. In Europe, on the other hand, they license spectrum per technology. So providers there are staying on the 3G bandwagon for as long as possible. When they move to 4G, they’ll have to pay new licensing fees.

For the record, LTE/Advanced is, according to James, truly a 4G technology.

After that? Well, bandwidth demand is doubling every couple years. Transmission technology can only do so much to keep up with that. Using more and smaller cells – down to the level of femtocells – will be a necessary complement to keep boosting overall system capacity.

Leave a Reply

featured blogs
May 6, 2026
Hollywood has struck gold with The Lord of the Rings and Dune'”so which sci-fi and fantasy books should filmmakers tackle next?...

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Designing Scalable IoT Mesh Networks with Digi XBee® for Wi-SUN
Sponsored by Mouser Electronics and Digi and Silicon Labs
In this episode of Chalk Talk, Quinn Jones from Digi, Chad Steider from Silicon Labs and Amelia Dalton explore how Wi-SUN Micro-Mesh can reduce cost and simplify deployment for your next IoT mesh network. They also investigate the benefits that Digi XBee solutions bring to these types of networks and how you can jump start your next IoT mesh network design with Silicon Labs and Digi.
May 4, 2026
8,347 views