editor's blog
Subscribe Now

DDR3 System On-and-Around the Chip

We saw the other day that Cadence was being aggressive with the memory controller IP from their Denali side. They’re actually trying to create a wider-scoped solution by providing a PCB package that ties in well with their DDR3 memory controller IP.

DDR memory timing is simply nuts, and board layout is critical. Everything matters. So the DDR3 Design-in kit contains the memory controller I/O and IC package model, timing/duration model, connector model, memory model, DIMM topology, and electrical constraints for the controller and memory.

While it ties in well with their DDR3 controller IP, it’s modular enough to detach that and still be of use with someone else’s controller IP.

More info in their Allegro press release

Leave a Reply

featured blogs
Oct 23, 2020
Processing a component onto a PCB used to be fairly straightforward. Through hole products, a single or double row surface mount with a larger center-line rarely offer unique challenges obtaining a proper solder joint. However, as electronics continue to get smaller and conne...
Oct 23, 2020
[From the last episode: We noted that some inventions, like in-memory compute, aren'€™t intuitive, being driven instead by the math.] We have one more addition to add to our in-memory compute system. Remember that, when we use a regular memory, what goes in is an address '...
Oct 23, 2020
Any suggestions for a 4x4 keypad in which the keys aren'€™t wobbly and you don'€™t have to strike a key dead center for it to make contact?...
Oct 23, 2020
At 11:10am Korean time this morning, Cadence's Elias Fallon delivered one of the keynotes at ISOCC (International System On Chip Conference). It was titled EDA and Machine Learning: The Next Leap... [[ Click on the title to access the full blog on the Cadence Community ...

featured video

Demo: Low-Power Machine Learning Inference with DesignWare ARC EM9D Processor IP

Sponsored by Synopsys

Applications that require sensing on a continuous basis are always on and often battery operated. In this video, the low-power ARC EM9D Processors run a handwriting character recognition neural network graph to infer the letter that is written.

Click here for more information about DesignWare ARC EM9D / EM11D Processors

featured paper

Designing highly efficient, powerful and fast EV charging stations

Sponsored by Texas Instruments

Scaling the necessary power for fast EV charging stations can be challenging. One solution is to use modular power converters stacked in parallel. Learn more in our technical article.

Click here to download the technical article

Featured Chalk Talk

Accelerate the Integration of Power Conversion with microBUCK® and microBRICK™

Sponsored by Mouser Electronics and Vishay

In the world of power conversion, multi-chip packaging, thermal performance, and power density can make all of the difference in the success of your next design. In this episode of Chalk Talk, Amelia Dalton chats with Raymond Jiang about the trends and challenges in power delivery and how you can leverage the unique combination of discrete MOSFET design, IC expertise, and packaging capability of Vishay’s microBRICK™and microBUCK® integrated voltage regulators.

Click here for more information about Vishay microBUCK® and microBRICK™ DC/DC Regulators