editor's blog
Subscribe Now

A Simple Brown Paper Bag

Yesterday I went to Mentor’s U2U user event. Something was missing – and it was a good thing.

We editors probably go to more events than your average engineer, but even an engineer that goes to a couple per year  must end up with a basement full of black ballistic nylon bags of various shapes and sizes with logos that ensure that his or her kids will never want to be seen in public with them. We may like the technology behind the logos, but they’re not considered “cool brands.”

I’ve actually gotten to where I decline the bags; I simply ask for the contents. Otherwise I might as well be collecting inventory to open a store. I was actually denied the opportunity to decline the bag at the recent TSMC event: the person behind the counter must have been instructed that everyone was to get a bag, and, by god, everyone was going to get one, including me.

But yesterday was different: it featured a simple brown paper bag. It’s already in the recycling bin. It will not be degrading in my garage or a landfill for the next 100,000 years. Granted, it was a smaller event than your ESC or DAC, but still, it was refreshing. It’s nice to have something to carry stuff around in during a conference – if you haven’t already brought your own (so make it optional). But it doesn’t have to last longer than the return home.

And it probably saves money too. Seems like a win-win.

(I’ll have more to say about the actual meat of the event separately.)

Leave a Reply

featured blogs
Nov 23, 2022
The current challenge in custom/mixed-signal design is to have a fast and silicon-accurate methodology. In this blog series, we are exploring the Custom IC Design Flow and Methodology stages. This methodology directly addresses the primary challenge of predictability in creat...
Nov 22, 2022
Learn how analog and mixed-signal (AMS) verification technology, which we developed as part of DARPA's POSH and ERI programs, emulates analog designs. The post What's Driving the World's First Analog and Mixed-Signal Emulation Technology? appeared first on From Silicon To So...
Nov 21, 2022
By Hossam Sarhan With the growing complexity of system-on-chip designs and technology scaling, multiple power domains are needed to optimize… ...
Nov 18, 2022
This bodacious beauty is better equipped than my car, with 360-degree collision avoidance sensors, party lights, and a backup camera, to name but a few....

featured video

How to Harness the Massive Amounts of Design Data Generated with Every Project

Sponsored by Cadence Design Systems

Long gone are the days where engineers imported text-based reports into spreadsheets and sorted the columns to extract useful information. Introducing the Cadence Joint Enterprise Data and AI (JedAI) platform created from the ground up for EDA data such as waveforms, workflows, RTL netlists, and more. Using Cadence JedAI, engineering teams can visualize the data and trends and implement practical design strategies across the entire SoC design for improved productivity and quality of results.

Learn More

featured paper

How SHP in plastic packaging addresses 3 key space application design challenges

Sponsored by Texas Instruments

TI’s SHP space-qualification level provides higher thermal efficiency, a smaller footprint and increased bandwidth compared to traditional ceramic packaging. The common package and pinout between the industrial- and space-grade versions enable you to get the newest technologies into your space hardware designs as soon as the commercial-grade device is sampling, because all prototyping work on the commercial product translates directly to a drop-in space-qualified SHP product.

Click to read more

featured chalk talk

Expanding SiliconMAX SLM to In-Field

Sponsored by Synopsys

In order to keep up with the rigorous pace of today’s electronic designs, we must have visibility into each step of our IC design lifecycle including debug, bring up and in-field operation. In this episode of Chalk Talk, Amelia Dalton chats with Steve Pateras from Synopsys about in-field infrastructure for silicon lifecycle management, the role that edge analytics play when it comes to in-field optimization, and how cloud analytics, runtime agents and SiliconMAX sensor analytics can provide you more information than ever before for the lifecycle of your IC design.

Click here for more information about SiliconMAX Silicon Lifecycle Management