industry news
Subscribe Now

Toshiba Memory Corporation and Synopsys Collaborate to Accelerate 3D Flash Memory Verification

Collaboration Enables 2X FineSim Pro FastSPICE Speed-up for NAND Flash Circuit Simulation

MOUNTAIN VIEW, Calif., May 30, 2018 /PRNewswire/ —

Highlights:

  • Synopsys FineSim Pro FastSPICE tool delivers 2X simulation speed-up for 3D NAND Flash
  • Monte Carlo optimizations enable additional 2X throughput for variability analysis
  • FineSim Pro optimized to handle large power distribution networks in 3D NAND Flash

Synopsys, Inc. (Nasdaq: SNPS) today announced that it has collaborated with Toshiba Memory Corporation to accelerate the verification of Toshiba Memory Corporation’s BiCS FLASH vertically stacked three-dimensional (3D) flash memory. By working closely with Toshiba Memory Corporation, Synopsys introduced innovative simulation algorithms in its FineSim® Pro FastSPICE tool to address the increased design complexity of 3D NAND Flash memory. These new technologies improve simulation speed by an average of 2X, thereby reducing multi-day simulation runs to less than a day.

Compared to traditional Flash devices, 3D Flash devices have much larger memory arrays, more complex analog and programming circuits, and extensive power distribution network.  Additionally, due to the stacked memory array structure, 3D Flash designs must deal with increased coupling effects due to layout parasitic elements. This increased complexity results in multi-day simulation times when using existing circuit simulation technology. Through close collaboration with Toshiba Memory Corporation, the latest release of FineSim Pro FastSPICE delivers several key technologies specifically optimized for 3D Flash simulation, for efficient handling of massive array structures, large power distribution network, increased layout parasitic elements, and high-precision analog circuits.

“FineSim has been our signoff circuit simulator since early 2000. Our long collaboration with Synopsys has enabled us to develop best-in-class Flash memory products for a broad range of applications,” said Shigeo (Jeff) Ohshima, Technology Executive SSD Application Engineering of Toshiba Memory Corporation. “By working closely with Synopsys we’re able to deploy FineSim Pro for verification of our latest BiCS Flash memories and meet our stringent quality and reliability requirements.”

“Advanced flash memory designs require extensive circuit simulation to ensure design robustness, reliability, and cost competitiveness,” said Paul Lo, corporate vice president of Engineering in the Design Group at Synopsys. “Our team is committed to continuing our close collaboration with Toshiba Memory Corporation to deliver novel circuit simulation technologies to meet the challenging needs of simulating complex 3D NAND Flash memories and enable Super Chips with Synopsys.”

About Synopsys

Synopsys, Inc. (Nasdaq: SNPS) is the Silicon to Software partner for innovative companies developing the electronic products and software applications we rely on every day. As the world’s 15th largest software company, Synopsys has a long history of being a global leader in electronic design automation (EDA) and semiconductor IP and is also growing its leadership in software security and quality solutions. Whether you’re a system-on-chip (SoC) designer creating advanced semiconductors, or a software developer writing applications that require the highest security and quality, Synopsys has the solutions needed to deliver innovative, high-quality, secure products. Learn more at www.synopsys.com.

Leave a Reply

featured blogs
Aug 15, 2018
Yesterday was the first of two posts about Cadence Automotive Solutions. Today we go down into the details a bit more. However, there are so many details that this will be more of a map of the landscape so you get an idea of the breadth of our technology. Each item could have...
Aug 14, 2018
I worked at HP in Ft. Collins, Colorado back in the 1970s. It was a heady experience. We were designing and building early, pre-PC desktop computers and we owned the market back then. The division I worked for eventually migrated to 32-bit workstations, chased from the deskto...
Aug 14, 2018
Introducing the culmination of months of handwork and collaboration. The Hitchhikers Guide to PCB Design is a play off the original Douglas Adams novel and contains over 100 pages of contains......
Aug 9, 2018
In July we rolled out several new content updates to the website, as well as a brand new streamlined checkout experience. We also made some updates to the recently released FSE locator tool to make it far easier to find your local Samtec FSE. Here are the major web updates fo...
Jul 30, 2018
As discussed in part 1 of this blog post, each instance of an Achronix Speedcore eFPGA in your ASIC or SoC design must be configured after the system powers up because Speedcore eFPGAs employ nonvolatile SRAM technology to store its configuration bits. The time required to pr...