industry news
Subscribe Now

GLOBALFOUNDRIES Strengthens 22FDX® eMRAM Platform with eVaderis’ Ultra-low Power MCU Reference Design

Co-developed technology solution enables significant power and die size reductions for IoT and wearable products

Santa Clara, Calif., February 27, 2018 – GLOBALFOUNDRIES and eVaderis today announced that they are co-developing an ultra-low power microcontroller (MCU) reference design using GF’s embedded magnetoresistive non-volatile memory (eMRAM) technology on the 22nm FD-SOI (22FDX®) platform. By bringing together the superior reliability and versatility of GF’s 22FDX eMRAM and eVaderis’ ultra-low power IP, the companies will deliver a technology solution that supports a broad set of applications such as battery-powered IoT products, consumer and industrial microcontrollers, and automotive controllers.

eVaderis designed their MCU to leverage the efficient power management capabilities of the 22FDX platform, achieving more than 10 times the battery life and a significantly reduced die size compared to previous generation MCUs. The technology, developed through GF’s FDXcelerator™ Partner Program, will help designers push performance density and flexibility to new levels to achieve a more compact, cost-effective single-chip solution for power-sensitive applications.

“The innovative architecture of eVaderis’ ultra-low power MCU IP, designed around GF’s 22FDX eMRAM technology, is well suited for normally-off IoT applications,” said Jean-Pascal Bost, President and CEO of eVaderis. “Utilizing GF’s eMRAM as a working memory allows sections of the eVaderis MCU to power cycle frequently, without incurring the typical MCU performance penalty. eVaderis looks forward to making this silicon-proven IP available to our customers by the end of this year.”

“Wearable and IoT devices require long-lasting battery life, increased processing capability, and the integration of advanced sensors,” said Dave Eggleston, VP of Embedded Memory at GF. “As an FDXcelerator partner, eVaderis is developing an optimized MCU architecture in GF’s 22FDX with eMRAM that helps customers meet demanding requirements.”

The jointly developed reference design with GF’s 22FDX with eMRAM will be available in Q4 2018. Process design kits for 22FDX with eMRAM and RF solutions are available now. Customer prototyping of 22FDX eMRAM on multi-project wafers (MPWs) is underway, with risk production planned for 2018. Off-the-shelf eMRAM macros are available now, featuring easy design-in with both eFlash and SRAM interface options.

Customers that are interested in learning more about GF’s 22FDX with eMRAM solution, co-developed in partnership with Everspin Technologies, contact your sales representative or visit globalfoundries.com. 

About eVaderis

Founded in 2014, eVaderis is the first company worldwide to offer innovative IP solutions based on new, disruptive embedded memory technologies including MRAM and RRAM. The company provides highly competitive products and design services to meet the challenges of producing advanced non-volatile memories, compilers, logic libraries and processor subsystems, paving the way for new chip design paradigms. eVaderis is a member of GLOBALFOUNDRIES’ FDXcelerator™ Partner Program. For more information about the company and its products, please visit www.evaderis.com.

About GF

GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Investment Company. For more information, visit http://www.globalfoundries.com.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Industrial Drives and Pumps -- onsemi and Mouser Electronics
Sponsored by Mouser Electronics and onsemi
In this episode of Chalk Talk, Amelia Dalton and Bob Card and Hunter Freberg from onsemi discuss the benefits that variable frequency drive, semiconductor optimization, and power switch innovation can bring to industrial motor drive applications. They also examine how our choice of isolation solutions and power packages can make a big difference for these kinds of applications and how onsemi’s robust portfolio of intelligent power modules, current sensing solutions and gate drivers are a game changer when it comes to industrial motor drive applications.
Mar 25, 2024
4,599 views