industry news
Subscribe Now

Diving into MEMS, Sensors and Imaging Technologies for a Smart, Connected World at SEMI|MSIG European Summit

Speakers to explore autonomous vehicles, robotics, smart IoT, biomedical, consumer tech, September 20-22 in Grenoble, France

GRENOBLE, France ─ July 20, 2017 – STMicroelectronics CEO Carlo Bozotti will kick off SEMI® and MEMS & Sensors Industry Group®’s(MSIG) co-located European MEMS & Sensors Summit 2017 and European Imaging & Sensors Summit (September 20-22 in Grenoble, France) with his keynote on the next wave of sensors and actuators in smart connected devices. CEA-Leti CEO Marie Noelle Semeria will share her vision on the future of image sensing combined with other innovative sensors for augmented reality (AR) and virtual reality (VR). EON Reality CEO Mats Johansson will explore pervasive and contextual AR and VR. Fraunhofer Institute for Photonic Microsystems (IPMS) Director Hubert Lakner will discuss the creation of a new cooperative German research fab that will strengthen the European microelectronics industry. These are just a few of the European technology leaders who will consider how MEMS, sensors, and imaging technologies are advancing the human experience with diverse applications in every imaginable technology sector.

“Our upcoming European Summit is a must-attend event for connecting directly with the leading European companies and research institutes who are driving technology and creating opportunities in MEMS, sensors, and imaging,” said Laith Altimime, president, SEMI Europe. “With global leaders such as Bosch and STMicroelectronics investing more than $1B Euros each in imaging, MEMS, and semiconductor manufacturing in Europe — and with European innovators advancing autonomous driving, augmented and virtual reality, biomedical, robotics, the Internet of Things, and more — attendees of our European Summit will gain critical insights into achieving success in the MEMS, sensors, and imaging supply chains by participating in this unique event.”

Other Highlights

  • Feature Presentations

o   Sensor as a Solution — Chae LeeLG Electronics

o   Image Sensors for Future VR — Yiwan Wong, Oculus Research

o   Custom Approach from Lens Design to the Next Generation of 360-degree VR Applications — Simon Thibault, Laval University and Immervision

o   Role of Inertial Sensing in Autonomous Driving — Tommi Vilenius, Automotive Business Development, Murata

o   A Backup Solution for Your Experiences — Peter Hartwell, TDK/InvenSense

o   From Sensors to Cloud: IoT Solutions for a Smart World — Sandra Pradilla, KAM Europe & Africa Distribution Channel,Libelium

Register before August 15 for a discount:

SEMI European Summits will take place at the MINATEC innovation campus at 3 parvis Louis Néel, Grenoble, France.

Premier sponsors of the MEMS & Sensors Summit include: Gold Sponsors ASE Group and SUSS MicroTec Group; Silver Sponsors Applied Materials, EV Group, Mentor, and SPTS Technologies. Event sponsors include: Advanced Micro-Fabrication Equipment Inc. (AMEC), JSR Micro N.V., Okmetic, and Trymax.

Premier sponsors of the Imaging & Sensors Summit include Platinum Sponsor STMicroelectronics and Event Sponsor ULIS.

About SEMI | MEMS & Sensors Industry Group

SEMI connects over 2,000 member companies and 1.3 million professionals worldwide annually to advance the technology and business of electronics manufacturing. For more information, visit www.semi.org.

MEMS & Sensors Industry Group (MSIG), a SEMI Strategic Association Partner, advances MEMS and sensors across global markets. For more information, visit: www.semi.org/en/msig-information-hub and follow MSIG on LinkedIn and Twitter (use @MEMSGroup).

Leave a Reply

featured blogs
Jul 17, 2018
As I mentioned last week in my blog about narrowband IoT , 4G is the standard that is used across the radio interface of most of the connected phones in the world. 4G is the fourth generation of this standard (and LTE is kind of like Rev2 of 4G), mostly dealing with the speed...
Jul 16, 2018
Each instance of an Achronix Speedcore eFPGA in your ASIC or SoC design must be configured after the system powers up because Speedcore eFPGAs employ nonvolatile SRAM technology to store the eFPGA'€™s configuration bits. Each Speedcore instance contains its own FPGA configu...
Jul 12, 2018
A single failure of a machine due to heat can bring down an entire assembly line to halt. At the printed circuit board level, we designers need to provide the most robust solutions to keep the wheels...