industry news
Subscribe Now

DesignSpark from RS Components brought to the High Street by Barclays Eagle Labs

Supporting innovation in communities with world-leading engineering insight, equipment and technical expertise

London, UK, 1 February 2018 – RS Components (RS), a trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, has formed a strategic alliance with Eagle Labs, ( https://labs.uk.barclays/ ) a Barclays initiative to foster innovation in communities. As technology partner, RS will support Eagle Labs with world-leading engineering equipment and technical expertise from its RS Local innovation centres and DesignSpark, its thriving online community of 650,000 makers, students and design engineers.

The aims of Eagle Labs are closely aligned with RS’ focus on empowering communities with the digital and technological skills they need to unlock collaborative innovation projects. Launched two years ago within underutilised Barclays high street branches, there are now 13 Eagle Labs providing spaces that offer open and membership-based access to digital fabrication tools, a LoRaWAN SigFox base station, education workshops, rapid prototyping facilities and a vibrant community.

The first lab that RS is supporting is the IoT Centre of Excellence in Cardiff, which opened 31 January 2018, with a phased roll out to other locations thereafter. Called the DesignSpark Lab, RS is providing:

·       A selection of products from its own-brand range, RS Pro, including essential electronic equipment, consumables and personal protection items;

·       Access to DesignSpark, its online platform of resources, community support and technical tools, to support the engineering design process; and

·       Development equipment, such as Raspberry Pi, to provide education and programming support to transform ideas into real-world applications.
Steven Roberts, Managing Director of Strategic Transformation at Barclays, said: “Eagle Labs and RS Components share the same ambition of providing communities the digital skills to thrive. By partnering with the leading provider of IoT components and tools and connecting the Eagle Lab network to their DesignSpark community, we are excited about how we can support members of the Cardiff Ecosystem to create, innovate and grow.”

Richard Curtin, Vice President – Global Strategic Alliances at RS, said: “Eagle Labs is an exciting initiative and mirrors the ethos of RS, which is all about supporting innovation and bringing great ideas to life. As a business, we’re perfectly placed to provide equipment and technical support through our RS Local innovation centres as well as DesignSpark, our growing community of makers, inventors and design engineers. This is key to inspiring and supporting people in the community; it’s exciting to think that the next big invention could be born from this initiative and we’re proud to have become part of it.”
For more information about Eagle Labs, visit https://labs.uk.barclays.

About RS Components
RS Components and Allied Electronics & Automation are the trading brands of Electrocomponents plc, the global distributor for engineers. We offer more than 500,000 industrial and electronic products, sourced from 2,500 leading suppliers, and provide a wide range of value-added services to over one million customers. With operations in 32 countries, we trade through multiple channels and ship around 50,000 parcels a day.

Electrocomponents is listed on the London Stock Exchange and in the last financial year ended 31 March 2017 had revenues of £1.51bn.

For more information, please visit the website at http://www.rs-online.com.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

SLM Silicon.da Introduction
Sponsored by Synopsys
In this episode of Chalk Talk, Amelia Dalton and Guy Cortez from Synopsys investigate how Synopsys’ Silicon.da platform can increase engineering productivity and silicon efficiency while providing the tool scalability needed for today’s semiconductor designs. They also walk through the steps involved in a SLM workflow and examine how this open and extensible platform can help you avoid pitfalls in each step of your next IC design.
Dec 6, 2023
18,777 views