industry news
Subscribe Now

Concurrent Technologies Announces Support for the Latest Xeon Mobile Processors and Launches a 6U VPX Board in Conjunction with Eizo Rugged Solutions

Concurrent Technologies launches VR E7x/msd, a new 6U VPX computing board based upon the newly announced launch of the Intel® Xeon® processor E-2176M (formerly known as Coffee Lake-H).  Supporting 50% more processor cores within the same power envelope, the Intel Xeon processor E-2176M has six-cores compared to previous generation quad-core processors from the same product family.  In addition to the launch of VR E7x/msd 6U VPX board, Concurrent Technologies is introducing the same processor across a number of other form factors including VMEbus. Further announcements will follow as boards are officially released.

In addition to improved processing capability, VR E7x/msd includes the option of front panel mounted USB 3.1 ports, 10 Gigabit Ethernet connectivity, enhanced storage options and improved digital graphics outputs.  Direct attached storage options include a SATA flash disk and two M.2 modules. These utilize PCI Express® connectivity and NVMe support for a high capacity solution that is suitable for use in challenging environments. VR E7x/msd is designed to fulfil a system management role for high performance 6U VPX processing solutions and so includes the option for dual XMC modules to support I/O expansion.  

Initial shipments of the product will be air-cooled, with production quantities expected in Q3.  A conduction-cooled version designed to meet an operating temperature range of -40°C to +85°C will be available after further qualification testing.  Initial operating system support will be for Linux® and Windows® with optional support for others such as VxWorks® will follow based on customer demand.

Glen Fawcett, CEO of Concurrent Technologies, commented:” From our inception in 1985, we have based our product line on Intel’s roadmap and launches of the latest embedded processors.  Our new 6U VPX product announcement further demonstrates this commitment to launch cutting edge products as early as possible in the silicon life-cycle to meet our customer requirements.”

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Connectivity Solutions for Smart Trailers
Smart trailers can now be equipped with a wide variety of interconnection systems including wire-to-wire, wire-to-board, and high-speed data solutions. In this episode of Chalk Talk, Amelia Dalton and Blaine Dudley from TE Connectivity explore the evolution of smart trailer technology, the different applications within a trailer where connectivity would be valuable, and how TE Connectivity is encouraging innovation in the world of smart trailer technology.
Oct 6, 2023
25,848 views