industry news
Subscribe Now

Synopsys’ IC Compiler II Certified for TSMC’s 12-nm Process Technology

MOUNTAIN VIEW, Calif., March 15, 2017 /PRNewswire/ —

Highlights:

  • 12-nm physical implementation flow is fully enabled in IC Compiler II place-and-route and IC Validator physical signoff
  • Joint development of innovative new area-optimization technologies, including  new standard cell structures support by IC Compiler II
  • Custom Compiler is ready to use with TSMC’s 12-nm process, with immediate availability of the Process Design Kits (PDKs)

Synopsys, Inc. (Nasdaq: SNPS) today announced that TSMC has certified the complete suite of products in the Synopsys Galaxy™ Design Platform for the most current version of 12-nanometer (nm) FinFET process technology. This 12-nm certification brings with it the broad body of design collateral, including routing rules, physical verification runsets, signoff-accurate extraction technology files, SPICE correlated timing and interoperable process design kits (iPDKs) for this latest FinFET process. Synopsys Custom Compiler™ design solution support is enabled through an iPDK.

To accelerate access to this power-efficient, high-density process, IC Compiler™ II place-and-route system has been enabled to support new standard cell architectures seamlessly co-existing with 16FFC intellectual property (IP). Recent collaborations have resulted in enhancements to IC Compiler II’s core placement and legalization engines ensuring maximum utilization while minimizing placement fragmentation and cell displacement. The 12-nm ready iPDK enables designers to use Custom Compiler’s layout assistant features to shorten time in creating FinFET layouts.

“This power-efficient, high-density node offers a broad set of opportunities to our customers, enabling them to deliver highly differentiated products,” said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. “Our ongoing collaboration with Synopsys is helping expedite designer access to 12-nm process technology.”

“The long-standing collaboration between Synopsys and TSMC continues to be key in bringing accelerated access to new process technology nodes,” said Bijan Kiani, vice president of product marketing for the Design Group at Synopsys. “With the Galaxy Design Platform certified for 12-nm readiness, our mutual customers are enabled to speed up development and deployment to accelerate their time-to-market.”

About Synopsys

Synopsys, Inc. (Nasdaq: SNPS) is the Silicon to Software partner for innovative companies developing the electronic products and software applications we rely on every day. As the world’s 15th largest software company, Synopsys has a long history of being a global leader in electronic design automation (EDA) and semiconductor IP, and is also growing its leadership in software security and quality solutions. Whether you’re a system-on-chip (SoC) designer creating advanced semiconductors, or a software developer writing applications that require the highest security and quality, Synopsys has the solutions needed to deliver innovative, high-quality, secure products. Learn more at www.synopsys.com.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Achieving High Power Density with IGBT and SiC Power Modules
Sponsored by Mouser Electronics and Infineon
Recent trends in the inverter market have made high power density, scalability, and ease of assembly more important than ever before. In this episode of Chalk Talk, Amelia Dalton and Abraham Markose from Infineon examine how Easy & Econo power modules from Infineon can help solve common inverter design requirements. They explore the benefits and construction of these modules and how you can take advantage of them in your next design.
May 19, 2023
37,772 views