IRVINE, Calif., Oct. 25, 2016 /PRNewswire/ — Toshiba America Electronic Components, Inc. (TAEC) has enhanced its lineup of managed NAND devices with the addition of new Embedded Multimedia Card (e–MMC) and Universal Flash Storage (UFS) embedded memory solutions. Featuring enhanced integrated controller technologies, the new ‘Supreme+’ e–MMC (JEDEC ver. 5.1) and UFS (JEDEC ver. 2.1) offerings deliver significant read and write speed improvements to demanding applications.
In contrast to raw NAND flash memory solutions, e–MMC and UFS devices integrate NAND flash memory and a controller chip in a single package. This saves space and relieves host processors of the burden of key memory management functions including bad block management, error correction, wear leveling, and garbage collection. As a result, e–MMC and UFS devices simplify design when compared to standalone memory ICs with a standard NAND flash interface.
Available in capacities from 16GB to 128GB, Toshiba’s new e-MMC devices are based on the company’s 15nm process technology – which makes for a chip size that is among the world’s smallest. Sequential read and write speeds of 320MB/sec and 180MB/sec are approximately two percent and 20 percent faster than the read and write speeds of Toshiba’s previous devices[1]. Random read and write speeds are approximately 100 percent and 140 percent faster than previous devices[1].
While e–MMC reaches a theoretical limit with an 8bit parallel interface of 400MB/sec, UFS memory extends interface performance through high-speed differential signaling using a MIPI M-PHY interface. This results in theoretical performance of 1166MB/sec by supporting a 2-lane MIPI M-PHY HS-G3 interface.
The new UFS devices are also based on Toshiba’s 15nm MLC NAND flash technology and are available in capacities from 32GB to 128GB. When compared to previous devices, sequential read and write speeds of 850MB/sec and 180MB/sec represent improvements of approximately 40 percent and 16 percent, while random read and write performance is improved by approximately 120 percent and 80 percent, respectively[1].
Toshiba manufactures both the flash memory and the controller technology deployed in its e–MMC and UFS memory devices. The company also developed in-house the analogue M-PHY 3.0 core and digital UniPro 1.6 core that are integrated with the new UFS controller. As a result, the controller is closely matched to the requirements of managing the target flash memory, which ensures optimized device performance.
For more information on Toshiba’s flash memory solutions, please visit toshiba.com/technologymoves, read the TAEC Memory Blog and follow the company on Facebook and Twitter.
[1] Comparisons made between the top performance part of the new version and previous generation among all capacity models
Universal Flash Storage (UFS) is a trademark and product category for a class of embedded memory products built to the JEDEC UFS standard specification.
e-MMC is a trademark and a product category for a class of embedded memory products built to the JEDEC e-MMC Standard specification.
Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. For details, please refer to applicable product specifications.
Read and write speeds are calculated as 1MB/sec = 1,000,000bytes/sec. Actual read and write speed may vary depending on the device, read and write conditions, and file size.
*About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today’s leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan’s largest semiconductor, solid state drive and hard disk drive manufacturer and the world’s seventh largest semiconductor manufacturer (Gartner, 2015 Worldwide Semiconductor Revenue, January, 2016). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 550 consolidated companies employing over 188,000 people worldwide (as of March 31, 2016). Visit Toshiba’s web site at http://toshiba.semicon-storage.com.
