industry news
Subscribe Now

Xilinx Showcases All Programmable Solutions for Data Center Acceleration at Intel Developers Forum 2015

SAN JOSE, Calif.Aug. 17, 2015 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced it will showcase All Programmable solutions for data center acceleration at Intel Developers Forum 2015. Through a series of demonstrations, Xilinx will highlight high-performance workload acceleration solutions enabling operators to increase data center efficiency and capacity, optimize the return on invested capital, and decrease operating costs. To learn more, visit Xilinx at booth #458, September 18-29, 2015 at the Moscone West Convention Center, San Francisco, California.

Xilinx Demonstrations – Booth 458

  • NVMe over Fabric for Hyper Scale Storage Applications
    This Xilinx demonstration utilizes a Kintex® UltraScale™ FPGA and showcases the ability to deliver high performance, low latency NVMe storage traffic over an Ethernet network. This solution addresses the critical issue of next-generation data center storage scalability.
  • SDAccel ™ Development Environment for OpenCL, C and C++
    Demonstration of Xilinx’s SDAccel™ development environment enabling the compilation of OpenCL applications into binaries ready for execution on FPGA devices using a standard programming environment.

About Xilinx

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs, and 3D ICs. Xilinx uniquely enables applications that are both software defined and hardware optimized – powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT, and 5G Wireless. For more information, visit www.xilinx.com.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Maximizing High Power Density and Efficiency in EV-Charging Applications
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Amelia Dalton and Daniel Dalpiaz from Infineon talk about trends in the greater electrical vehicle charging landscape, typical block diagram components, and tradeoffs between discrete devices versus power modules. They also discuss choices between IGBT’s and Silicon Carbide, the advantages of advanced packaging techniques in both power discrete and power module solutions, and how reliability is increasingly important due to demands for more charging cycles per day.
Dec 18, 2023
17,921 views