industry news
Subscribe Now

Exar 16:1 Sensor Interface Connects Multiple Sensors to MCUs or FPGAs

Fremont, CA – July 6, 2015 – Exar Corporation (NYSE: EXAR), a leading supplier of high-performance integrated circuits and system solutions, introduces a highly integrated sensor interface analog front end (AFE) that provides calibration of sensor outputs.  The XR10910 offers an onboard 16:1 differential multiplexer, offset correction DAC, programmable gain instrumentation amplifier and voltage reference. This AFE provides 14-bit signal path linearity and is designed to connect multiple bridge sensors to a microcontroller (MCU) or field-programmable gate array (FPGA) with an embedded ADC.

The integrated, DAC provides offset calibration for any offset voltage generated by bridge sensors, improving overall system sensitivity and accuracy. An independent offset value can be set for each of the 16 differential inputs. The XR10910 allows the customer to select from eight fixed-gain settings (from 2V/V to 760V/V) to ensure the amplified sensor signal falls within the optimum input range of the downstream ADC. The integrated LDO provides a regulated voltage to power the sensors and is selectable between 3V and 2.65V for lower voltage compatibility. An I2C serial interface provides an easy way to control the XR10910’s many functions.

The XR10910 operates from 2.7V to 5V supplies and offers a wide digital supply range of 1.8V to 5V. It typically consumes 457µA of supply current and offers a sleep mode which reduces the supply current to only 45µA.

“The XR10910 provides designers with an easy-to-use sensor interface that integrates high channel count and functionality in a tiny footprint that is lower power than competing solutions,” said Dale Wedel, Exar’s vice president, high-performance analog products.  “Its unique feature set complements modern low cost MCUs in a variety of applications such as force sensing, rebel droids and power monitoring for solar energy and data centers.”

The XR10910 is available in a RoHS compliant, green/halogen free, space-saving 6mm x 6mm QFN package. Pricing starts at $8.10 each for 1,000-piece quantities. For more information, visit www.exar.com/xr10910.

Summary of features:

  • Designed to interface multiple bridge sensors with an MCU or FPGA
  • Integrated features simplify sensor conditioning
  • 16:1 differential MUX, programmable gain INA, LDO and offset correction DAC
  • Eight selectable voltage gains from 2V/V to 760V/V with only ±0.5% gain error
  • 6mm x 6mm QFN-40 package

About Exar

Exar Corporation designs, develops and markets high performance integrated circuits and system solutions for the industrial & embedded systems communications, high-end consumer and infrastructure markets. Exar’s broad product portfolio includes analog, display, LED lighting, mixed-signal, power management, connectivity, data management and video processing solutions. Exar has locations worldwide providing real-time customer support.  For more information, visit www.exar.com.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Electromagnetic Compatibility (EMC) Gasket Design Considerations
Electromagnetic interference can cause a variety of costly issues and can be avoided with a robust EMI shielding solution. In this episode of Chalk Talk, Amelia Dalton chats with Sam Robinson from TE Connectivity about the role that EMC gaskets play in EMI shielding, how compression can affect EMI shielding, and how TE Connectivity can help you solve your EMI shielding needs in your next design.
Aug 30, 2023
29,740 views