industry news
Subscribe Now

4DSP Introduces Xilinx SDAccel Support and UltraScale FPGA Performance for Its Compact Embedded System

May 26, 2015 — Austin, TX – 4DSP today announced two new additions to its Compact Embedded System (CES) line. The CES820 and the ruggedized CESCC820 variant both feature an upgraded Xilinx Kintex UltraScale FPGA and support for the new SDAccel development environment. These standalone, small form factor systems are complete and generic processing platforms for data acquisition, signal processing, and communication. The powerful UltraScale FPGA provides a flexible processing backbone for interfacing to the FMC site, CPU, and external DDR3 SDRAM, with plenty of room left over for high-performance digital signal processing.

“Our continuing focus on building complimentary products for our industry-leading FMC line has been validated yet again with the successful introduction of the CES820,” said Richard Gary, 4DSP Sales Manager. “From our discussions with key customers, we know that these products have received tremendous interest. They offer high-end data acquisition and processing in small, ruggedized form factors, making them ideal for an incredible number of applications in both the lab and the field.”

The CES820 enclosure measures about five inches per side and weighs less than 1 Kg. Designed with Size, Weight and Power (SWaP) in mind, this system provides a quad-core, low-power Atom CPU that is tightly coupled to the UltraScale FPGA and FPGA Mezzanine Card (FMC – VITA 57.1). The CES820 is ideal for development and prototyping purposes. It can serve as a customizable standalone lab computer and instrument or as a deployed embedded solution. The ruggedized CESCC820 version features a slightly larger, more robust, and vibration-resistant chassis which offers conduction cooling and space for additional FMC modules. It optionally offers a dual 10Gb Ethernet port for high-bandwidth applications in the military and aerospace markets. These characteristics give the CESCC820 I/O versatility and flexible functionality while enabling the system to be deployed in a wider range of demanding environments.

The CES820 and CESCC820 systems are the first 4DSP products to support the revolutionary Xilinx SDAccel development environment, opening up new algorithm acceleration possibilities for low-power digital signal processing applications. “With SDAccel, Xilinx has introduced the first architecturally optimizing compiler for OpenCL, C, and C++, enabling software engineers to dynamically program the functionality they need inside of the FPGA,” said Yousef Khalilollahi, Senior Director, Aerospace and Defense, Xilinx. “Combined with SDAccel, the 4DSP CES820 and CESCC820 deliver high-level programmability for anti-jamming, compression, encryption, high-performance signal processing in communication signal analysis, and other advanced Aerospace & Defense applications.”

FMCs for the CES820 and CESCC820 can be selected from 4DSP’s extensive and diverse portfolio or from a third-party vendor. The 4DSP Board Support Package (BSP) and StellarIP firmware tool and library are included with these systems, allowing designers to jump into development with modular reference designs that exercise the systems’ capabilities and provide high-level interfaces and driver support.

More details about these products can be found here:
http://www.4dsp.com/CES820.php
http://www.4dsp.com/CES820CC.php

Features

System IO

  • HDMI
  • USB
  • eSATA (not available for ruggedized system)
  • 1Gb Ethernet
  • 2x 10Gb Ethernet (optional)
  • FMC HPC site
  • JTAG
  • PCIe communication between processor and FPGA
  • Processor – System Controller
  • Intel Atom Quad Core 1.91 GHz Processor
  • 2GB DDR3 SDRAM
  • 64GB SSD (2x 64GB SSD option available for ruggedized system)
  • Windows and Linux support
  • FPGA
  • Kintex UltraScale XCKU040
  • 4GB DDR3 SDRAM
  • SDAccel support
  • Power
  • DC16V – 30V
  • Dimensions and Weight
  • CES820
  • 132 x 75 x 125 mm (WxHxD)
  • 0.86 Kg
  • CESCC820
  • Enclosure base – 148 x 163 mm (WxD)
  • Enclosure body – 121 x 163 mm (WxD)
  • Height – 100 mm
  • Weight – 3.0 Kg

Applications

  • Beamforming
  • Direction finding
  • Software defined radio (SDR)
  • Satellite communications systems
  • RADAR/SONAR Image Processor
  • RADAR & Radio Jamming
  • JPEG2000 Video Image Processors
  • Baseband Communications Transceivers
  • Multi-channel digital receivers
  • Up to 64M-point floating-point FFT processing
  • Event Processor & Recorder
  • Board Support Package

StellarIP is available for this product. It offers a simple way to design FPGA firmware with automated code and bitstream generation.

  • Board control and monitoring tools
  • Flash programming utility
  • Confidence tests
  • Host-side API
  • Software program example
  • Xilinx ISE projects
  • Test firmware and VHDL source code
  • Drivers for Windows and Linux
  • Embedded operating system options are available. Contact sales@4dsp.com for more details.
  • Download the BSP datasheet for more information.

About 4DSP LLC

4DSP is an innovative Austin, Texas-based corporation dedicated to the design and manufacture of commercial off-the-shelf (COTS) board-level electronics, FPGA Intellectual Property (IP Core), and system level solutions. With the most advanced digitizers and FPGA-based products, 4DSP has a reputation for delivering high-performance DSP solutions for the specific embedded computing requirements of Military, Aerospace, Biomedical and Chemical Science applications. As an AS9100 certified company, 4DSP excels at providing solutions that make an impact in both the lab and the field. More information about 4DSP can be found at http://www.4dsp.com.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Industrial Internet of Things (IIoT)
Sponsored by Mouser Electronics and Eaton
In this episode of Chalk Talk, Amelia Dalton and Mohammad Mohiuddin from Eaton explore the components, communication protocols, and sensing solutions needed for today’s growing IIoT infrastructure. They take a closer look at how Eaton's circuit protection solutions, magnetics, capacitors and terminal blocks can help you ensure the success of your next industrial internet of things design.
Jun 14, 2023
36,008 views