EEJournal

industry news
Subscribe Now
April 13, 2015

Evaluate Industrial Sensors Faster With First Quad IO-LINK® Master Reference Design

San Jose, CA—April 13, 2015—Designers now have a single platform to develop their own IO-Link master and multiple industrial sensors. The MAXREFDES79# from Maxim Integrated Products, Inc. (NASDAQ: MXIM) allows manufacturers to bring IO-Link factory automation designs to market faster.

For more information about MAXREFDES79#, visit www.maximintegrated.com/en/design/reference-design-center/system-board/6095.html.

As the first ever IO-Link master reference design, MAXREFDES79# reduces the cost and time required to develop and evaluate both IO-Link master and IO-Link sensor systems. While previous IO-Link master development units featured only one port, Maxim’s MAXREFDES79# IO-Link master allows up to four sensors to be tested at one time. As an IO-Link compliant system, MAXREFDES79# works with any IO-Link sensor on the market today. MAXREFDES79# complements four Maxim sensor reference designs (MAXREFDES23# light sensor, MAXREFDES27# proximity sensor, MAXREFDES36# 16-channel digital input, and MAXREFDES42# RTD temp sensor) to make the process quick and easy for customers to simulate factory operation.

MAXREFDES79# is a highly integrated development platform with software stack. The system has four ports, one for each IO-Link master (MAX14824) and integrates power supply products. MAXREFDES79# uses the industry’s fastest (400µs) COM 3 communication, comes with an adapter, and is enabled with a microUSB data connection.

Key Advantages

  • Flexible and highly integrated: 4-port master with software stack can test any four IO-Link sensors
  • Faster time to market: easy to plug in and quickly evaluate external sensors
  • Affordable: significantly reduces both IO-Link master and sensor development time

Commentary

  • “Maxim leveraged its expertise in IO-Link technology and analog integration to develop MAXREFDES79#, the industry’s most flexible and economical IO-Link master development platform for industrial automation,” said Timothy Leung, Senior Business Manager at Maxim Integrated. “IO-Link sensor developers now have a readily available reference design for quick evaluation to get ahead of the curve in Industry 4.0.”
  • “Historically, the industrial sector was overlooked because of its complexity, but this is changing as the market potential increases,” said Colin Barnden, Principal Analyst at Semicast Research. “Maxim’s MAXREFDES79# reference design is an original approach to advancing an emerging technology like IO-Link to address the industrial market’s surging growth.”

Availability and Pricing

  • The MAXREFDES79# board with software stack is available for $500. The initial unit costs $415 at Maxim’s website and select franchised distributors. Hardware and firmware design files, as well as test data, are provided free and available online.
  • An unlimited software license is available for $85 from TEConcept:www.teconcept.de/index_en.php.
  • For information on other reference designs, please visit Maxim’s Reference Design Center.

About Maxim Integrated

Maxim is the leader in analog integration. From mobile to industrial solutions, we’re making analog smaller, smarter, and more energy efficient. Learn more at www.maximintegrated.com.

Leave a Reply

featured blogs
Captivating Component Art
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
More from Max's Cool Beans...
Why Analog Design Challenges Need Breakthrough Technologies
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....
More from Synopsys...

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

Achieve Greater Design Flexibility and Reduce Costs with Chiplets

Sponsored by Keysight

Chiplets are a new way to build a system-on-chips (SoCs) to improve yields and reduce costs. It partitions the chip into discrete elements and connects them with a standardized interface, enabling designers to meet performance, efficiency, power, size, and cost challenges in the 5 / 6G, artificial intelligence (AI), and virtual reality (VR) era. This white paper will discuss the shift to chiplet adoption and Keysight EDA's implementation of the communication standard (UCIe) into the Keysight Advanced Design System (ADS).

Dive into the technical details – download now.

featured chalk talk

Accessing AWS IoT Services Securely over LTE-M
Sponsored by Mouser Electronics and AWS and SparkFun Electronics and u-blox
Developing a connected IoT design from scratch can be a complicated endeavor. In this episode of Chalk Talk, Amelia Dalton, Harald Kröll from u-blox, Lucio Di Jasio from AWS, and Rob Reynolds from SparkFun Electronics examine the details of the AWS IoT ExpressLink SARA-R5 starter kit. They explore the common IoT development design challenges that AWS IoT ExpressLink SARA-R5 starter kit is looking to solve and how you can get started using this kit in your next connected IoT design.
Click here for more information about the u-blox SARA-R510AWS LTE-M AWS IoT ExpressLink Module
Oct 26, 2023
24,887 views