industry news
Subscribe Now

Xilinx First to Move 20nm FPGAs into Volume Production

SAN JOSE, Calif.Dec. 18, 2014 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced that its Kintex® UltraScale KU040 FPGAs are now the industry’s first 20nm device to move into volume production. Customers can benefit from an estimated one year time to market advantage relative to its competition. Built on the industry’s only ASIC-class architecture, the mid-range Kintex UltraScale devices provide optimal price/performance/watt for a broad set of applications that include 100G OTN, packet processing and traffic management, 8X8 Mixed Mode LTE and WCDMA Radio, 8K/4K displays, Intelligence Surveillance and Reconnaissance (ISR), Data Center and more. 

“Building on the strength of our innovation, strong engineering execution, and commitment to absolute quality, Xilinx is pleased to move the KU040 into full production,” said Wouter Suverkropp, senior product line manager for Kintex FPGAs at Xilinx.  “This milestone follows months of design work by our customers, leveraging the performance of the UltraScale architecture.”

Availability

Customers can place orders for the KU040 FPGAs today by contacting their local Xilinx sales representative.  Kintex UltraScale development and evaluation boards are available from Xilinx and its Alliance Members.  Xilinx boards include the KCU105 universal development board and the KCU1250 transceiver evaluation board.  To buy these boards, visit www.xilinx.com/boards-and-kits.

About Kintex UltraScale FPGAs

Kintex UltraScale FPGAs deliver up to 1.16M logic cells, 5,520 optimized DSP slices, 76 Mbits of block RAM, 16.3Gbps backplane-capable transceivers, PCIe® Gen3 hard blocks, integrated 100Gb/s Ethernet MAC and 150 Gb/s Interlaken IP Cores, and DDR4 memory interfaces operating at 2,400 Mb/s. Kintex devices established the new mid-range with best price/performance at the lowest power in 28 nm, and offer the highest DSP count available at 20 nm.

About Xilinx

Xilinx is the world’s leading provider of All Programmable FPGAs, SoCs and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

The Future of Intelligent Devices is Here
Sponsored by Alif Semiconductor
In this episode of Chalk Talk, Amelia Dalton and Henrik Flodell from Alif Semiconductor explore the what, where, and how of Alif’s Ensemble 32-bit microcontrollers and fusion processors. They examine the autonomous intelligent power management, high on-chip integration and isolated security subsystem aspects of these 32-bit microcontrollers and fusion processors, the role that scalability plays in this processor family, and how you can utilize them for your next embedded design.
Aug 9, 2023
30,687 views