industry news
Subscribe Now

Accelerate control systems and increase integration while decreasing system cost with TI’s new C2000™ Piccolo™ F2807x MCUs

Houston (Oct. 23, 2014) – Need a microcontroller (MCU) that allows you to quickly double system performance without doubling your cost or changing your hardware or software design? With the powerful combination of the C28x CPU and accelerators, the new C2000™ Piccolo™ F2807x MCUs from Texas Instruments (TI) (NASDAQ: TXN) boost execution speeds of control tasks in industrial applications such as telecom rectifiers, server power, solar micro inverters, frequency inverters and automotive HEV/EV. The F2807x MCUs also provide many analog and control peripherals to enable more integrated control applications. They are scalable with the previously announced C2000 Delfino™ F2837xS and F2837xD MCU generations. 

Real-time control accelerator (CLA) doubles system performance

Designers looking to tap into the performance of the C2000 Piccolo F2807x MCUs can leverage the real-time control accelerator (CLA). The CLA doubles the throughput of the F2807x MCU, providing an additional 120 MHz of floating-point processing capability. This additional bandwidth allows designers to run parallel math-intensive or time-sensitive signal processing tasks. Offloading these tasks to the CLA enables the CPU to focus on general system tasks such as diagnostics, communications, motion profiling and more. Also integrated in the main C28x CPU is a trigonometric math unit (TMU) accelerator, which enables the chip to quickly execute trigonometric-based algorithms used in transforms and control functions.

Analog and control integration

TI’s C2000 Piccolo F2807x MCUs are also packed with high-end, smart analog and control integration — including a flexible, enhanced pulse-width modulator (PWM) that supports all digital power topologies — to decrease digital control system complexity. Three 12-bit ADCs increase sampling throughput by allowing designers to do simultaneous tasks such as monitor voltages and currents of three-phase motors while simultaneously decoding high-frequency resolver feedback. Additionally, the F2807x MCUs can simultaneously process eight delta-sigma modulated channels, each with threshold comparators and a seamless interface to the TI AMC1204 isolated delta-sigma modulator, for isolated current and voltage measurements. Window comparators provide critical power stage protection.

Scalability enables customers to create complete portfolios

Using the same C28x core and many of the same peripherals, the C2000 Piccolo F2807x MCUs are pin- and software-compatible with the previously introduced dual-core Delfino F2837xD and single-core Delfino F2837xS MCUs, enabling motor developers to get to market faster with a variety of products that feature a range of signal processing, flash performance, and analog and control peripheral options. Also easing development, the C2000 F2807x Experimenter’s Kit and controlCARD allow designers ease in evaluating the C2000 Piccolo F2807x MCUs for their latest innovations.

Centralized software development

TI makes software development of its F2807x MCUs easy with examples, header files, application libraries and much more available incontrolSUITE™ software. The Eclipse-based Code Composer Studio™ integrated development environment v6 accompanies these MCUs, and third-party support from Altair provides more software programming options for this new platform.

Pricing and availability

Fully featured C2000 Piccolo F2807x 32-bit MCUs (TMX320F28075) are now sampling. Production versions of the F28075 and F28074 (TMS320F28074) will start at less than $9 USD in 1K unit orders. Developers can evaluate their new Piccolo F2807x MCUs using the Experimenter’s Kit docking station (TMDXDOCK28075) for $189 and include the modular controlCARD (TMDXCNCD28075) for $129.

Innovation is at the core of TI MCUs

Beginning with the foundation of leading process technology and adding unique system architecture, intellectual property and real-world system expertise, TI continues its 20+ years of MCU innovation with low-power and performance MCUs. With unique products for ultra-low power, low-power performance and security communications, to real-time control, control and automation, and safety, designers can accelerate time to market with TI’s ecosystem of tools, software, wireless connectivity solutions, extensive Design Network offerings and technical support. 

About Texas Instruments

Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping more than 100,000 customers transform the future, today. Learn more at www.ti.com.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Maximizing High Power Density and Efficiency in EV-Charging Applications
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Amelia Dalton and Daniel Dalpiaz from Infineon talk about trends in the greater electrical vehicle charging landscape, typical block diagram components, and tradeoffs between discrete devices versus power modules. They also discuss choices between IGBT’s and Silicon Carbide, the advantages of advanced packaging techniques in both power discrete and power module solutions, and how reliability is increasingly important due to demands for more charging cycles per day.
Dec 18, 2023
18,042 views