industry news
Subscribe Now

STMicroelectronics Outlines Always-On 6-Axis Ultra-Performance Accelerometer/Gyroscope Combo that Drops the Power/Space Bar

Geneva, September 9, 2014 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, the world’s top MEMS (Micro-Electro-Mechanical Systems) manufacturer and the leading supplier of MEMS for consumer and mobile applications[1], today announced its development of the first iNEMO™ Ultra product – an always-on, high-performance 6-axis combination accelerometer and gyroscope that sets new standards for device and system power efficiency, signal noise, and performance in motion sensors. In concert with ST’s ultra-low-power STM32 Microcontrollers, the LSM6DS3 combos will create new possibilities for the development of battery-powered smart sensor systems to be embedded in mobile and wearable devices and innovative objects for the Internet of Things (IoT).

The tiny (2.5mm x 3.0mm x 0.8mm), iNEMO Ultra 6-axis inertial-sensor combo (3-axis accelerometer/3-axis gyroscope) delivers industry-leading noise performance[2] while effectively managing system power with state-of-the-art technology that in testing has proven to be typically 20% more energy-efficient than the best alternative combos in low-power mode while delivering outstanding performance and protecting valuable board real estate.

This is in part, due to the market’s largest “smart” FIFO (First-In First-Out) memory (8kbytes) — at least 2 times larger than any else available. This flexible memory allows the LSM6DS3 to save and batch more data before waking up the system processor, saving overall system power, too. Moreover, ST has leveraged its robust and mature manufacturing processes for the production of its industry-leading micro-machined accelerometers and gyroscopes, while manufacturing its IC interfaces using CMOS technology. This choice supports trimming of dedicated circuits to better match sensing-element characteristics.

“Our new 6-axis ultra-combo is designed to operate at the lowest power and best noise density in the market and will make Internet-of-Things devices far more efficient and convenient,” said Benedetto Vigna, ST Executive Vice President and General Manager of the Analog, MEMS & Sensors Group. “With this latest addition to our industry-leading portfolio, our mastery of our own full supply chain, and the expertise and leadership to build system-level efficiency into everything we make, ST continues to raise the bar for motion-sensor performance.”

The LSM6DS3 will be delivered as an optimized 2-chip system-in-package featuring high-performance 3-axis digital accelerometer and 3-axis digital gyroscope with integrated power-efficient modes down to 0.6mA in always-on working mode. The new combo combines always-on low-power features with superior sensing precision for best-in-class motion detection and analysis with ultra-low noise.

The LSM6DS3’s event-detection interrupts enable efficient and reliable motion tracking and context awareness that is implemented in hardware. This allows for recognition of free-fall events, 6D orientation, tap and double-tap sensing, activity or inactivity, and wake-up events. With ST’s experience in supporting the requirements of the main operating systems, the LSM6DS3 will be able to efficiently process real, virtual, and batch-mode sensors, saving power and enabling faster system reaction time. Indeed, the new combo is designed to implement in hardware Significant Motion, Tilt, Pedometer Functions, and Time Stamp, and to support the data acquisition of an external magnetometer with both hard and soft iron correction.

Finally, the LSM6DS3 will offer hardware flexibility to connect pins with different mode connections to external sensors to fulfill additional functionalities as a sensor hub, auxiliary SPI (Serial Peripheral Interface), and other vital capabilities.

The LSM6DS3 combo will be available in Q4 2014.

[1] Source: IHS Consumer and Mobile MEMS Market Tracker H1 2013

2 Accelerometer = 90 ?g/?Hz (typ) in high-performance mode with Output Data Rate (ODR) @104Hz and 0.6 mg-rms (typ) in high-performance mode ODR @104Hz. 
Gyroscope = 0.007 °/s/?Hz (typ) in high-performance mode @10Hz and 0.07 °/s-rms in high-performance mode with ODR @208Hz.

About STMicroelectronics

ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power and automotive products and embedded processing solutions. From energy management and savings to trust and data security, from healthcare and wellness to smart consumer devices, in the home, car and office, at work and at play, ST is found everywhere microelectronics make a positive and innovative contribution to people’s life. By getting more from technology to get more from life, ST stands for life.augmented.

In 2013, the Company’s net revenues were $8.08 billion. Further information on ST can be found at www.st.com.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Electromagnetic Compatibility (EMC) Gasket Design Considerations
Electromagnetic interference can cause a variety of costly issues and can be avoided with a robust EMI shielding solution. In this episode of Chalk Talk, Amelia Dalton chats with Sam Robinson from TE Connectivity about the role that EMC gaskets play in EMI shielding, how compression can affect EMI shielding, and how TE Connectivity can help you solve your EMI shielding needs in your next design.
Aug 30, 2023
29,637 views