industry news
Subscribe Now

Microchip Expands XLP Low-Power PIC® Microcontroller Portfolio With Integrated Hardware Encryption Engine

CHANDLER, Ariz., June 24, 2014 [NASDAQ:  MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced from the Sensors Expo in Rosemont, IL the expansion of its eXtreme Low Power (XLP) PIC® microcontrollers (MCUs) with the PIC24F “GB2” family.  This new family features an integrated hardware crypto engine, a Random Number Generator (RNG) and One-Time-Programmable (OTP) key storage for protecting data in embedded applications.  The PIC24F “GB2” devices offer up to 128 KB Flash and 8 KB RAM in small 28- or 44-pin packages, for battery-operated or portable applications such as “Internet of Things” (IoT) sensor nodes, access control systems and door locks.

Watch a short video:  http://www.microchip.com/get/65A4

View a brief presentation:  http://www.microchip.com/get/UTK3

Several security features are integrated into the PIC24F “GB2” family, to protect embedded data.  The fully featured hardware crypto engine, supporting the AES, DES and 3DES standards, reduces software overhead, lowers power consumption and enables faster throughput.  This is another example of Microchip’s Core Independent Peripherals, which can run with no CPU supervision.  Also, a Random Number Generator creates random keys for data encryption, decryption and authentication, to provide a higher level of security.  For additional protection, the One-Time-Programmable (OTP) key storage prevents the encryption key from being read or overwritten.  These security features increase the integrity of embedded data without sacrificing power consumption.  With XLP technology, the “GB2” family achieves 180 µA/MHz Run currents and 18 nA Sleep currents, for very long battery life in portable applications.

For connectivity, the “GB2” family integrates USB for device or host connections, as well as a UART with ISO7816 support, which is helpful for smartcard applications.  With these features, the PIC24F “GB2” devices protect embedded data while conserving power and maximizing battery life, all in packages as small as 28-pin QFN for medical/fitness applications (e.g., pedometers, wearable fitness, handheld devices), computer applications (e.g., PC peripherals, printers, portable accessories) and industrial applications (e.g., security door locks, access control systems, security cameras, POS terminals, smart card readers, heat/gas meters, IOT sensor nodes).  Microchip also has a flexible range of certified wireless modules for Wi-Fi®, ZigBee®, Bluetooth® and Bluetooth Low Energy, making it easy to add wireless connections to a PIC24 “GB2” application.

“With Internet of Things growing at a rapid rate, protecting embedded data and extending battery life are not an option, but a necessity,” said Joe Thomsen, vice president of Microchip’s MCU16 Division.  “Our latest eXtreme Low Power family, combined with Microchip’s embedded Wi-Fi and Bluetooth solutions, enable low-power wireless connectivity to Internet-connected things.  Designers achieve faster throughput, lower BOM cost, secure data and very long battery life.”

Development Support

The PIC24F “GB2” family is supported by Microchip’s standard suite of world-class development tools, including the Explorer 16 Development Board (part # DM240002, $129.99), PIC24FJ128GB204 Plug In Module for USB (part # MA240037, $25.00), PIC24FJ128GA204 Plug In Module for non-USB (part # MA240036, $25.00) and USB PICtail™ Plus Daughter Board  (part # AC164131, $60.00).  In addition, wireless connections can be added using one of  Microchip’s Wireless PICtail Daughter Boards, including the WiFi PICtail Development Board (part # RN-171-PICtail $39.95), and Bluetooth LE PICtail/PICtail Plus  (part # RN-4020-PICtail, $49.00). 

Pricing & Availability

Product variants are available with USB (PIC24FJXXXGB2XX) and without USB (PIC24FJXXXGA2XX).  The PIC24FJ128GB204, PIC24FJ64GB204, PIC24FJ128GA204 and PIC24FJ64GA204 are offered in 44-pin TQFP and QFN packages.  The PIC24FJ128GB202, PIC24FJ64GB202, PIC24FJ128GA202 and PIC24FJ64GA202 are available in 28-pin SOIC, SSOP, SPDIP and QFN packages.  All of these new MCUs are available today for sampling and volume production, starting at $1.30 each in volume.

For additional information, contact any Microchip sales representative or authorized worldwide distributor, or visit Microchip’s Web site at http://www.microchip.com/get/GNUT.  To purchase products mentioned in this press release, go to microchipDIRECT or contact one of Microchip’s authorized distribution partners.

Follow Microchip:

About Microchip Technology

Microchip Technology Inc. (NASDAQ:  MCHP) is a leading provider of microcontroller, mixed-signal analog and Flash-IP solutions, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide.  Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality.  For more information, visit the Microchip website at http://www.microchip.com/get/FM3N.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Maximizing High Power Density and Efficiency in EV-Charging Applications
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Amelia Dalton and Daniel Dalpiaz from Infineon talk about trends in the greater electrical vehicle charging landscape, typical block diagram components, and tradeoffs between discrete devices versus power modules. They also discuss choices between IGBT’s and Silicon Carbide, the advantages of advanced packaging techniques in both power discrete and power module solutions, and how reliability is increasingly important due to demands for more charging cycles per day.
Dec 18, 2023
17,921 views