industry news
Subscribe Now

InvenSense™ and Sonion Announce Strategic Microphone Development Alliance

San Jose, California, March 27, 2014 – InvenSense, Inc. (NYSE: INVN), the leading provider of MotionTracking™ system on chip (SoC) and Sound devices, and Sonion A/S, the global leader in micro acoustic and micro mechanical technologies and solutions for hearing instruments, in-ear earphones and specialty headsets, today announced a strategic alliance in which the two parties will cooperate in the development of MEMS microphones and related technologies for use in a broad range of hearing applications. InvenSense will bring its extensive MEMS knowledge, MEMS microphone portfolio and R&D resources to the partnership. Sonion will contribute with its in depth insight into development of high performance microphones, R&D resources and its highly specialized Application Engineering function addressing the hearing health market. Sonion will have exclusive rights to sell InvenSense MEMS microphone products into hearing aids for hearing health. InvenSense will be Sonion’s primary source of MEMS microphone products and related technologies, while InvenSense will continue to sell MEMS microphones into other hearing/microphone applications. 

  

“As the demand for MEMS solutions for hearing aids, hearing aid accessories, assistive listening/alerting and signaling system continues to rise, this alliance will have the joint benefit of accelerating both technology and customer access to bring the highest performance MEMS microphone technology to the hearing aid industry,” said Behrooz Abdi, President & CEO InvenSense. “We are proud to collaborate with Sonion, a worldwide market leader in micro acoustic and micromechanical technologies and solutions for hearing instruments, in-ear earphones and communication devices.”

  

“By adding MEMS microphones to our already very strong electret microphone portfolio, we will be in a unique position to support our customers in the hearing health market. We are impressed with the technology steps made by InvenSense in their MEMS microphones and we are excited to start working together. Looking forward, we see great opportunities for combining the knowledge of Sonion and InvenSense for making even more attractive MEMS based microphone products,” said Jørn Mørkeberg, CEO Sonion.

  

For additional information about the InvenSense Sound and MotionTracking devices, please visit www.invensense.com or contact InvenSense Sales at sales@invensense.com. Additional information about Sonion is available at www.sonion.com.

   

About InvenSense

InvenSense Inc. (NYSE: INVN) is the world’s leading provider of MotionTracking™ sensor system on chip (SoC) and Sound solutions for consumer electronic devices. The company’s patented InvenSense Fabrication Platform and patent-pending MotionFusion™ technology address the emerging needs of many mass-market consumer applications via improved performance, accuracy, and intuitive motion-, gesture- and sound-based interfaces. InvenSense technology can be found in consumer electronic products including smartphones, tablets, gaming devices, optical image stabilization, and remote controls for Smart TVs. The company’s MotionTracking products are also being integrated into a number of industrial applications. InvenSense is headquartered in San Jose, California and has offices in China, Taiwan, Korea, Japan, Slovakia, and Wilmington, MA. More information can be found atwww.invensense.com.

About Sonion

Sonion is a global leader in micro acoustic and micro mechanical technologies and solutions for use in hearing instruments, in-ear earphones and specialty headsets. The company’s product range includes balanced armature receivers, high performance microphones, telecoils and a number of micro mechanical components. Sonion employ 3,200 people and is headquartered in Roskilde, Denmark and has offices in Netherlands, US, Poland, Switzerland, China, Philippines and Vietnam. More information can be found atwww.sonion.com

 

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Introducing Altera® Agilex 5 FPGAs and SoCs

Sponsored by Intel

Learn about the Altera Agilex 5 FPGA Family for tomorrow’s edge intelligent applications.

To learn more about Agilex 5 visit: Agilex™ 5 FPGA and SoC FPGA Product Overview

featured paper

Achieve Greater Design Flexibility and Reduce Costs with Chiplets

Sponsored by Keysight

Chiplets are a new way to build a system-on-chips (SoCs) to improve yields and reduce costs. It partitions the chip into discrete elements and connects them with a standardized interface, enabling designers to meet performance, efficiency, power, size, and cost challenges in the 5 / 6G, artificial intelligence (AI), and virtual reality (VR) era. This white paper will discuss the shift to chiplet adoption and Keysight EDA's implementation of the communication standard (UCIe) into the Keysight Advanced Design System (ADS).

Dive into the technical details – download now.

featured chalk talk

Battery-free IoT devices: Enabled by Infineon’s NFC Energy-Harvesting
Sponsored by Mouser Electronics and Infineon
Energy harvesting has become more popular than ever before for a wide range of IoT devices. In this episode of Chalk Talk, Amelia Dalton chats with Stathis Zafiriadis from Infineon about the details of Infineon’s NFC energy harvesting technology and how you can get started using this technology in your next IoT design. They discuss the connectivity and sensing capabilities of Infineon’s NAC1080 and NGC1081 NFC actuation controllers and the applications that would be a great fit for these innovative solutions.
Aug 17, 2023
31,218 views