MOUNTAIN VIEW, Calif., – April 25, 2013 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today introduced the world’s first software-based Super-Resolution (SR) Technology for embedded applications, bringing PC system-equivalent imaging performance to low power mobile devices. The Super-Resolution algorithm was developed in-house by CEVA’s software engineering experts and is fully optimized to run in real-time using minimal processing workload and very low memory bandwidth on the CEVA-MM3101 imaging and vision platform. For example, in a 28nm process, the CEVA-MM3101 processor is able to take four 5MPixel images and fuse them into a single high-resolution 20MPixel image in a fraction of a second, while consuming less than 30mW.
CEVA’s Super-Resolution algorithm enables the creation of high resolution images using low resolution image sensors and allows high-quality digital zoom in real-time on mobile devices. Traditionally, such applications were only available on PC systems, limited to offline processing of pre-captured images. The Super-Resolution algorithms were developed and optimized specifically for the CEVA-MM3101, using CEVA’s advanced Compiler technology and the CEVA-CV library functions. In addition, utilizing low resolution image sensors to perform these functions can result in significant cost savings for the end device, and enables systems manufacturers and OEMs to bring these advanced capabilities to any device.
Jeff Bier, founder of the Embedded Vision Alliance (www.Embedded-Vision.com), commented: “Smartphones are the most commonly used devices for capturing still images and video, but the slim form factor of these devices places severe limitations on the quality of captured images. CEVA’s Super-Resolution algorithm, coupled with the CEVA-MM3101 imaging and vision processor, is an excellent example of how clever computer vision algorithms can be combined with optimized processor architectures to overcome physical limitations of imaging systems.”
Eran Briman, vice president of marketing at CEVA commented: “Our new Super-Resolution algorithm for the CEVA-MM3101 platform marks the first time that this technology is available in software for embedded applications. It is a testament to both the expertise of our highly skilled software engineers and to the low power capabilities of our CEVA-MM3101 platform, which comprises the hardware platform together with optimized algorithms, software components, kernel libraries, software multimedia framework and a complete development environment. We continue to lead the industry in the embedded imaging and vision domain and the addition of this latest high performance software component to our platform furthers illustrates the strength of our IP portfolio for advanced multimedia applications.”
The CEVA-MM3101 offers SoC designers an unrivalled IP platform for integrating advanced imaging and vision capabilities into any device. Coupled with CEVA’s internally developed computational photography and imaging expert algorithms such as dynamic range correction (DRC), color enhancement, digital image stabilizer and now Super-Resolution, CEVA’s customers are equipped with a full development platform for image enhancement and computer vision applications for any end market, including mobile, home and automotive. The development platform also incorporates CEVA-CV™, CEVA’s comprehensive computer vision library with more than 600 of the most commonly used vision functions, CEVA’s Natural User Interface (NUI) partner software ecosystem, software development tools, hardware development kits and the new AMF™ low energy Android Multimedia Framework. For more information, visit www.ceva-dsp.com/CEVA-MM3101.html.
CEVA will present and demonstrate its Super-Resolution technology at the Embedded Vision Summit on April 25, 2013 at the San Jose Convention Center.
About CEVA, Inc.
CEVA is the world’s leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA’s IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2012, CEVA’s IP was shipped in more than 1 billion devices, powering smartphones from many of the world’s leading OEMs, including HTC, Huawei, Lenovo, LG, Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.
