industry news
Subscribe Now

Arasan Chip Systems Announces 3rd Generation Hardware Validation Platform Family for Mobile Interface Standards

San Jose, California – December 8, 2011 – Arasan Chip Systems, Inc. (“Arasan”), a leading provider of Total IP Solutions, today introduced the third generation of its Hardware Validation Platform family targeted for validation of hardware and software infrastructure that comply with analog PHY based standards for serial connectivity between chips, camera and display modules, and flash storage in mobile platforms. Customers adopting emerging and existing protocols like MIPI’s Unipro, CSI-2 and DSI, JEDEC’s UFS and SDA’s SD4.0 can now leverage Arasan’s platforms to jump start and speed up their pre-silicon, silicon and system validation and applications development.  

Arasan’s Hardware Validation Platforms enable early validation of a new interface by emulating the complementary device at the interface protocol level. Beyond this, it facilitates early application development for reference board designs and production testing, before complementary devices are available in silicon. Further in the product cycle, it acts as a reference platform to help root-cause any incompatibilities between the device under development and the silicon device it is communicating with. Often, a developer of cutting edge silicon products with new standard interface protocols has no means of validating one’s design with complementary devices which themselves may be under development. When such complementary devices do become available, a full speed reference platform that faithfully adheres to the protocol and provides the accompanying software stacks is necessary to aid the bringup of a device trying to communicate with another for the first time, followed by rapid deployment of reference boards to OEM’s and production testing of the OEM’s end products. 

The previous generations of these platforms address these challenges for interface protocols that require digital interfaces, like MIPI’s SLIMbus and HSI, and SDA’s SD3.0. Arasan delivers all these platforms with the hardware and software binaries, with rich runtime tracing and debug capabilities. The platform family extends these capabilities to complex protocols that require analog PHY layer interfaces like MIPI’s D-PHY and M-PHY, and SDA’s UHS-II. UFS and the upcoming MIPI LLI and CSI-3 are based on the MIPI Unipro link protocols, which are complex and multi-layered in both hardware and software. 

“With the advent of increasingly complex, high speed serial connectivity protocols and the related time to market challenges, IP vendors need to move beyond silicon tapeout to end system product enablement. Arasan’s Hardware Validation Platforms augment its leading edge IP and software stack offering to do precisely that, and now with the third generation we have extended this capability to deliver Total IP Solutions for high speed serial protocols for mobile applications,” says Andrew Haines, Vice President of Marketing at Arasan Chip Systems. 

Availability 

The Hardware Validation Platforms for SD4.0, CSI-2/DSI, Unipro and UFS will be available in Q1 of 2012.   

About Arasan 

Arasan Chip Systems is a leading provider of Total IP Solutions for mobile storage and connectivity applications.   Arasan’s high-quality, silicon-proven, Total IP Solutions include digital IP cores, analog PHY interfaces, verification IP, hardware verification platforms, protocol analyzers, software stacks and drivers and optional customization services for MIPI, USB, SD, SDIO, MMC/eMMC, CF, UFS, xD and many other popular standards. Arasan’s Total IP products serve system architects and chip design teams in mobile, gaming and desktop computing systems that require silicon-proven, validated IP, delivered with the ability to integrate and verify both digital, analog and software components in the shortest possible time with the lowest risk.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Introducing AlteraĀ® Agilex 5 FPGAs and SoCs

Sponsored by Intel

Learn about the Altera Agilex 5 FPGA Family for tomorrowā€™s edge intelligent applications.

To learn more about Agilex 5 visit: Agilexā„¢ 5 FPGA and SoC FPGA Product Overview

featured paper

AlteraĀ® FPGAs and SoCs with FPGA AI Suite and OpenVINOā„¢ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Miniaturization Impact on Automotive Products
Sponsored by Mouser Electronics and Molex
In this episode of Chalk Talk, Amelia Dalton and Kirk Ulery from Molex explore the role that miniaturization plays in automotive design innovation. They examine the transformational trends that are leading to smaller and smaller components in automotive designs and how the right connector can make all the difference in your next automotive design.
Sep 25, 2023
27,288 views