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PRO DESIGN Expands Prototyping Portfolio with ultra-fast proFPGA Virtex® UltraScale+™ based FPGA Modules

Austin, 19 June 2017 – PRO DESIGN, veteran in the EMS and EDA industry, today releases three new high-speed FPGA modules for its successful and innovative proFPGA product family of FPGA based prototyping solutions at the Design Automation Conference (DAC) in Austin, Texas.

The proFPGA product series are the most modular, flexible and scalable systems on the market based on latest Xilinx Virtex® UltraScale™, UltraScale+™ and Intel® Stratix®10 FPGA technologies. It addresses customers who need a most efficient and high-performance FPGA based prototyping solution for ASIC and IP prototyping, real time system integration and pre-silicon software development to reduce the … Read More → "PRO DESIGN Expands Prototyping Portfolio with ultra-fast proFPGA Virtex® UltraScale+™ based FPGA Modules"

Synopsys Delivers Verification IP and Test Suite for ARM AMBA 5 CHI Issue B Specification

MOUNTAIN VIEW, Calif., June 19, 2017 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) today announced the availability of its Verification IP (VIP) and source code test suite for ARM® AMBA® 5 Coherent Hub Interface (CHI) Issue B. Synopsys VC VIP for AMBA CHI has been widely adopted by SoC leaders for successful verification closure and tape out of coherent subsystems and interconnects. Synopsys VIP for the latest AMBA CHI Issue B specification enables customers and partners to extend the standard architecture for their next-generation coherent designs with new enhancements for increased performance.

“Coherent systems are being adopted rapidly in a wide range … Read More → "Synopsys Delivers Verification IP and Test Suite for ARM AMBA 5 CHI Issue B Specification"

GLOBALFOUNDRIES®, ON Semiconductor Deliver the Industry’s Lowest Power Bluetooth® Low Energy SoC Family

Singapore and Santa Clara, Calif., June 19, 2017 – GLOBALFOUNDRIES and ON Semiconductor (Nasdaq: ON) today announced the availability of a System-on-Chip (SoC) family of devices, on GF’s 55nm Low Power Extended (55LPx), RF-enabled process technology platform. ON Semiconductor’s new RSL10 products are based on a multi-protocol Bluetooth 5 certified radio SoC capable of supporting the advanced wireless functionalities in IoT and “Connected” Health and Wellness markets.

“Bluetooth low energy technology continues to advance as the key enabler for connecting IoT devices, especially with low power consumption requirements,” said Robert Tong, vice president of ON Semiconductor’s Medical and … Read More → "GLOBALFOUNDRIES®, ON Semiconductor Deliver the Industry’s Lowest Power Bluetooth® Low Energy SoC Family"

Saelig Introduces Mercury™ T2C USB 2.0 & Power Delivery Protocol Analyzer With Type-C Connection

Fairport, NY: Saelig Company, Inc. announces the availability of the Mercury™ T2C USB 2.0 & Power Delivery Protocol Analyzer that offers the newest USB Type-C connection. The Mercury T2C is a small and affordable hardware-based USB protocol analyzer. It is the industry’s first ultra-portable, hardware-based, USB and Power Delivery protocol analyzer. It combines the de-facto standard CATC Trace™ display, comprehensive USB class decoding, and PD 2.0 protocol analysis. The pocket-sized, bus-powered Mercury T2C sits in-line between host and device and provides transparent capture of all USB transactions.
Within minutes of installing the Windows PC-compatible software, users will … Read More → "Saelig Introduces Mercury™ T2C USB 2.0 & Power Delivery Protocol Analyzer With Type-C Connection"

Cadence Expands Online Tool Access for ARM DesignStart Customers to Accelerate SoC Design Delivery

SAN JOSE, Calif., June 20, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced expanded support for the enhanced ARM® DesignStart™ program, including the newly added ARM Cortex®-M3 processor and the ARM CoreLink™ SDK-100 System Design Kit, which includes the fully verified CoreLink SSE-050 subsystem, enabling engineers to further accelerate the delivery of mixed-signal internet of things (IoT) designs. The Cadence® Hosted Design Solutions (HDS) design environment provides secure servers, storage, and EDA software accessible from anywhere in the world, incorporating Cadence mixed-signal solutions that have been optimized for use with Cortex-M series processors.

To simplify the customer … Read More → "Cadence Expands Online Tool Access for ARM DesignStart Customers to Accelerate SoC Design Delivery"

Premier Farnell makes BBC micro:bit coding device available to buy from Newark element14 and MCM Electronics

Chicago, 20th June 2017, Premier Farnell, the Development Distributor, has made the BBC Micro:bit available to buy in North America through Newark element14 and MCM Electronics.

The micro:bit was originally launched in the UK in March 2016 following an educational programme led by the BBC, in partnership with a group of technology partners including ARM, Microsoft and Premier Farnell. The programme included the gifting of one million micro:bits to support digital learning in schools. Premier Farnell are the exclusive manufacturer of the micro:bit and distribute the device through Farnell element14, CPC and a network of … Read More → "Premier Farnell makes BBC micro:bit coding device available to buy from Newark element14 and MCM Electronics"

IAR Systems supports ARM DesignStart Program with highly optimizing and reliable development tools

Uppsala, Sweden—June 21, 2017—IAR Systems®, the future-proof supplier of software tools and services for embedded development, announces that the company will partner with ARM on the newly enhanced ARM® DesignStart™ program. System on Chip (SoC) designers now have the option to use the powerful development toolchain IAR Embedded Workbench® for SoC development using DesignStart Cortex®-M processors, making development faster and more reliable.

The enhanced ARM DesignStart program enables the creation of custom SoCs using the ARM Cortex-M0 and Cortex-M3 processors with no upfront license fee, and provides a verified subsystem for a wide range of applications, … Read More → "IAR Systems supports ARM DesignStart Program with highly optimizing and reliable development tools"

Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node

DESIGN AUTOMATION CONFERENCE, AUSTIN, Texas, June 20, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its custom/analog and full-flow digital and signoff tools are now enabled for v0.5 of the GLOBALFOUNDRIES 7nm Leading-Performance (7LP) FinFET semiconductor technology. The 7LP process node is expected to deliver 40 percent better performance and twice the area scaling than the previous 14nm FinFET technology.

GF has enabled the Cadence® implementation tools and reference flow for the 7LP platform, providing high-volume customers with the ability to create reliable, advanced-node chips for the high-performance compute (HPC), server/datacenter, premium mobility AP, machine learning … Read More → "Cadence Custom/Analog and Full-Flow Digital and Signoff Tools Enabled for GLOBALFOUNDRIES 7LP Process Node"

72V Fixed-Ratio DC/DC Controller Eliminates Power Inductor & Delivers 500W in Non-Isolated Intermediate Bus Converter Applications

MILPITAS, CA & NORWOOD, MA – June 20, 2017 – Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTC7820, a high power fixed ratio charge pump DC/DC controller that eliminates the power inductor in a non-isolated intermediate bus converter, allowing up to a 50% reduction in circuit size and up to 4000W/in³ power density. The LTC7820 drives external MOSFETs in voltage divider, doubler or inverter configurations with an efficiency of up to 99%. Its open loop fixed duty is ideal for non-isolated intermediate bus applications in power distribution, datacom, telecom, high-end computing and industrial systems.

The LTC7820 operates over … Read More → "72V Fixed-Ratio DC/DC Controller Eliminates Power Inductor & Delivers 500W in Non-Isolated Intermediate Bus Converter Applications"

Synopsys and GLOBALFOUNDRIES Collaborate to Deliver Design Platform and IP Enablement for 7-nm FinFET Process

MOUNTAIN VIEW, Calif., June 20, 2017 /PRNewswire/ —

Highlights:

Synopsys Design Platform supports advances in GLOBALFOUNDRIES’ 7-nm low-power technology and Self-Aligned Double Patterning (SADP)

IC Compiler II enhancements include router advancements tuned to realize power-performance benefits of the 7-nm process

Familiar flow steps enhanced to meet new 7-nm requirements and implemented on design example including high performance memories

High-speed, high-density, ultra-density DesignWare Memory Compilers and HPC Design Kits deliver superior performance, power and area

Synopsys, Inc. (Nasdaq: SNPS) today announced the enablement of the Synopsys Design Platform and DesignWare® Embedded … Read More → "Synopsys and GLOBALFOUNDRIES Collaborate to Deliver Design Platform and IP Enablement for 7-nm FinFET Process"

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