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Samtec Features Latest High-Performance Copper and Optical Solutions at SC18

New Albany, IN: Samtec, a privately held $800 MM global manufacturer of a broad line of electronic interconnect solutions, will showcase and demonstrate their latest high-performance interconnect at SuperComputing 2018 in Dallas, TX.

Next-generation high-performance copper and optical interconnect must solve multiple technical challenges including higher data rates, increased system and chassis density, and improved signal integrity. Samtec’s diverse product and technology portfolio provides system designers architectural solutions to the challenges faced by the industry.

SC18 Demonstrations

VadaTech Announces new 6U OpenVPX Dual Xilinx Kintex UltraScale™ XCKU115 FPGA Board

Henderson, NV – November 8, 2018 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the VPX551 high-speed FPGA compute module for signal processing and beamforming applications.

The VPX551 provides dual Kintex UltraScale™ XCKU115 FPGAs, each providing over 1,400K logic cells, which interface directly to rear I/O via SERDES, LVDS and fiber. Each FPGA is supported by 16GB of 64-bit wide DDR4 (2 x Bank of 8GB) and 1GB flash. The rear panel fiber I/O is via six VITA 66.5 x12 modules, each of which can be populated as transmit … Read More → "VadaTech Announces new 6U OpenVPX Dual Xilinx Kintex UltraScale™ XCKU115 FPGA Board"

Renesas Electronics Introduces Innovative Safety Analysis Tool to Simplify Automotive ISO 26262 Compliance

TOKYO, Japan, November 8, 2018 — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, is announcing the release of the GUI CAR (Customizable Analysis Report) Tool, an innovative safety analysis tool that will enhance customers’ ability to quickly integrate Renesas products into their safety-critical automotive systems while increasing user confidence in system compliance to the latest safety standard. The powerful new FMEDA (failure mode effects and diagnostics analysis) tool is optimized for the Read More → "Renesas Electronics Introduces Innovative Safety Analysis Tool to Simplify Automotive ISO 26262 Compliance"

Pixus Announces Fully Redundant CompactPCI Chassis with Alarm Functionality

Waterloo, Ontario  —  Nov 08, 2018 –  Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers 1U-4U CompactPCI enclosures with full hot-swappability and redundancy.  

The new Pixus enclosures feature dual redundant A and B power feeds and power supplies.  The enclosures range from 1U to 4U sizes with backplanes from 2 to 8 slots.  The backplanes have stiffeners for additional support.  The chassis platforms can be adapted for cPCI Serial or OpenVPX designs upon request.  

ZF Switches and Sensors Energy Harvesting Engine Now Paired with Bluetooth® Low Energy

Hall B3 Booth 530

Electronica 2018, Munich, November 13-16 2018

Auerbach/Munich. ZF Switches and Sensors market leading energy harvesting engine can now be combined with the RSL10 SIP –an ultra-low-power Bluetooth 5 certified System in Package from ON Semiconductor. This enables the switch to be used with the rapidly growing number of applications for Bluetooth Low Energy communications.

The SIP solution features such ultra-low-power characteristics that a low loss Schottky Diode bridge rectifier and electrolytic capacitor is enough to provide power from the switch to the Bluetooth 5 device.</ … Read More → "ZF Switches and Sensors Energy Harvesting Engine Now Paired with Bluetooth® Low Energy"

Mode-Changing MEMS Accelerometer from STMicroelectronics Combines High Measurement Resolution and Ultra-Low Power for Industrial Applications

Geneva, November 6, 2018 — The STMicroelectronics IIS2DLPC 3-axis MEMS accelerometer can change operating mode on the fly, from ultra-low power to high resolution, enabling high-accuracy measurements within a limited energy budget. The sensor can provide continuous contextual awareness to wake the host system when action is required and take highly accurate measurements before returning to ultra-low power operation.

With this extra flexibility, users can build longer-lasting battery-powered industrial sensor nodes or medical devices, tamper-proof smart meters, and smart power-saving or motion-activated functions. In addition, the opportunity for extremely low power consumption enables smart accessories for industrial machinery or … Read More → "Mode-Changing MEMS Accelerometer from STMicroelectronics Combines High Measurement Resolution and Ultra-Low Power for Industrial Applications"

UnitedSiC introduces new UF3C “FAST” Silicon Carbide FET series

November 5, 2018, Princeton, New Jersey: UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, announces the launch of its UF3C FAST series of 650 V and 1200 V high-performance silicon carbide FETs in a standard TO-247-3L package. The FAST Series offers increased switching speeds and higher efficiency levels than their existing UJC3 Series.

Based on UnitedSiC’s proprietary cascode configuration, ( https://unitedsic.com/ … Read More → "UnitedSiC introduces new UF3C “FAST” Silicon Carbide FET series"

RS Components plays a leading role in the ‘electronica Experience’ aimed at the next generation of engineers

LONDON, UK, 9 November, 2018 – RS Components (RS), the trading brand of Electrocomponents plc (LSE: ECM), a global multi-channel distributor, is playing a major part in the inaugural ‘electronica Experience’ at this year’s electronica trade fair in Munich. Taking place in the brand new Hall C6, the electronica Experience aims to deliver advice and a first-hand technology experience to young people to help inspire them to pursue a career in engineering.

As well as exhibiting on its main stand (Hall C5, Stand 147), RS is using its additional 224m² space in Hall C6 to present Titan II, its 35-tonne … Read More → "RS Components plays a leading role in the ‘electronica Experience’ aimed at the next generation of engineers"

Synopsys Extends Synthesis Leadership with Next-Generation Design Compiler

MOUNTAIN VIEW, Calif., Nov 6, 2018 /PRNewswire/ —

Highlights:

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