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VadaTech Announces new Xeon E3 Processor AMC variants (PCIe Gen3, 10/40 GbE, SRIO Gen2)

Henderson, NV – June 19, 2017 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the AMC756, AMC757, AMC758 and AMC759. These are Processor AMCs (PrAMC) in AdvancedMC (AMC) form factor based on the 14nm Intel® Xeon® Processor E3-1505M v6 with CM238 PCH. The processor base frequency is 3.0 GHz with max turbo frequency of 4.0 GHz. The modules follow the AMC.1, AMC.2, AMC.3 and AMC.4 specifications as applicable and provide up to 16 GB of DDR4 memory with ECC and 64 GB of Flash for the OS. The modules have Serial … Read More → "VadaTech Announces new Xeon E3 Processor AMC variants (PCIe Gen3, 10/40 GbE, SRIO Gen2)"

Saelig Debuts Feature-Rich 3/6/12GHz RF Analog Signal Generators

Fairport, NY: Saelig Company, Inc. has announced Tabor’s Lucid LS RF Analog Signal Generators, offering advanced features and industry-leading performance in a compact form factor. The three models, LS3081M (3GHz), LS6081M (6GHz) and LS1291M (12GHz), provide single-channel high-purity sine waves in a small footprint module. Featuring extremely fast switching speed, superior signal integrity, and very low distortion, the Lucid range of RF generators also features all the necessary modulation signals required for testing modern analog communication systems. Built-in SPI and micro-USB interfaces allow for external control of the generators.

Imec Presents Complementary FET (CFET) as Scaling Contender for Nodes Beyond N3

LEUVEN (Belgium) – June 20, 2018 – At this week’s 2018 Symposia on VLSI Technology and Circuits, imec, the world-leading research and innovation hub in nanoelectronics and digital technology, will present a process flow for a complementary FET (CFET) device for nodes beyond N3. The proposed CFET can eventually outperform FinFETs and meet the N3 requirements for power and performance. It offers a potential area scaling of both standard cells (SDC) and memory SRAM cells by 50%.

The CFET is a further evolution of the vertically stacked gate all around nanowire transistor. Instead of stacking either n-type or p-type devices, it stacks … Read More → "Imec Presents Complementary FET (CFET) as Scaling Contender for Nodes Beyond N3"

Rohde & Schwarz delivers 3GPP C-V2X device testing for GCF protocol conformance

Munich, June 19, 2018 — Rohde & Schwarz, a leading supplier of test & measurement equipment, has further expanded the capabilities of its R&S CMW500 wideband radio communication tester and R&S SMBV100A GNSS simulator to support Global Certification Forum (GCF) protocol conformance tests for C-V2X device certification. Utilizing the Qualcomm(R) 9150 C-V2X chipset solution from Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, the R&S CMW500 acting as LTE network simulator now allows automakers to test C-V2X direct communications (PC5) according … Read More → "Rohde & Schwarz delivers 3GPP C-V2X device testing for GCF protocol conformance"

Plunify Launches Latest Version of InTime with Timing Optimization in the Cloud

SINGAPORE –– June 21, 2018 –– Plunify®, a leading design optimization technology provider, will launch the latest version of InTime™  at the Design Automation Conference (DAC) next week, offering on-demand development, optimization, testing and deployment of field programmable gate array (FPGA) designs.  

The latest version of InTime will introduce post-placement estimates analysis and support multiple concurrent compilations in the cloud to meet design performance … Read More → "Plunify Launches Latest Version of InTime with Timing Optimization in the Cloud"

congatec teams up with OSADL to optimize the support for Real-Time Linux

San Diego, CA, USA, June 21, 2018 * * * congatec – a leading vendor of standardized and customized embedded computer boards and modules – teams up with OSADL, Open Source Automation Development Lab eG, to optimize the board support for Real-Time Linux and showcase it in the OSADL test racks. In a first step, OSADL qualified congatec’s latest real-time Linux implementation that uses Linux kernel 4.9.47-rt37 on conga-TS170 Server-on-Modules equipped with the embedded server-class Intel® Xeon® processor (E3-1578L v5 @ 2.00 GHz). The COM Express Type 6 module mounted on the evaluation carrier board conga-TEVAL performed well in the tests, impressing … Read More → "congatec teams up with OSADL to optimize the support for Real-Time Linux"

RS Components introduces high-reliability DC/DC converters targeting medical applications

LONDON, UK, 21 June, 2018 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), a global multi-channel distributor, has announced availability of a new range of DC/DC converters that target use in medical applications. Offering high reliability and excellent value, the TIM 2 and TIM 3.5 series are manufactured by Traco Power ( Read More → "RS Components introduces high-reliability DC/DC converters targeting medical applications"

Certified NFC Forum Type 5 Chips from STMicroelectronics Bring Tamper-Detect Capability to Smaller, More Convenient Tags

Geneva, June 21, 2018 — STMicroelectronics’ ST25TV Type 5 NFC tag ICs combine the convenience of the ISO 15693 vicinity standard ISO 15693 tags operate at the 13.56 MHz frequency and offer maximum read distance of 1–1.5 meters with the extra advantage of tamper detection as well as strong cloning-prevention, data-protection, and user-privacy features.
 
ISO 15693 tags can benefit from smaller antennas and more reliable data exchange over longer distances than ISO 14443 tags. As the only ISO 15693 IC with tamper detection, the ST25TV makes tags for applications like tamper-proof packaging and electronic article … Read More → "Certified NFC Forum Type 5 Chips from STMicroelectronics Bring Tamper-Detect Capability to Smaller, More Convenient Tags"

UltraSoC embedded analytics and Imperas virtual platforms combine to enhance multicore development and debug

Cambridge, UK – 21 June 2018 / DAC, San Francisco, CA UltraSoC and Imperas today announced a wide-ranging partnership that will provide developers of multicore systems on chip (SoCs) with a powerful combination of embedded analytics and virtual platform technologies. Under the terms of the agreement, UltraSoC will incorporate key elements of Imperas’ development environment into its tools offering, giving designers a unified system-level pre- and post-silicon development flow, dramatically reducing time-to-revenue and overall development costs.

UltraSoC delivers the industry’s leading independent on-chip monitoring, analytics and debug technology, via a combination of semiconductor IP and associated software. Imperas’ pioneering virtual … Read More → "UltraSoC embedded analytics and Imperas virtual platforms combine to enhance multicore development and debug"

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