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Newark launches Design, Build, Maintain HUB to revolutionize product lifecycle support

Chicago – March 13, 2024: Newark has announced the launch of its new Design, Build, Maintain HUB. This innovative platform was created to support how developers, OEMs and industrial customers navigate every stage of the product lifecycle, from conception to maintenance.

With the design phase being crucial for laying the foundation of any successful product, Newark’s HUB provides developers with access to a vast array of in-stock … Read More → "Newark launches Design, Build, Maintain HUB to revolutionize product lifecycle support"

Vishay Intertechnology Upgrades TFBS4xx and TFDU4xx Series IR Transceiver Modules With Longer Link Distance and Improved ESD Robustness

MALVERN, Pa. — March 13, 2024 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it has upgraded its TFBS4xx and TFDU4xx series of infrared (IR) transceiver modules for IrDA® applications to offer 20 % longer link distance and improved ESD robustness to 2 kV. With support for data rates up to 115.2 kbit/s (SIR) and link distances of 1 meter, the devices are intended for wireless communication and data transmission in energy meters and monitors, industrial automation controls, mobile phones, and medical equipment. To increase battery life in portable devices, the modules offer low power consumption with an idle supply current of < 70 μA, … Read More → "Vishay Intertechnology Upgrades TFBS4xx and TFDU4xx Series IR Transceiver Modules With Longer Link Distance and Improved ESD Robustness"

Mercury Announces Early Access Program for New Direct RF Multi-Chip Module Powered by AMD Versal Adaptive SoCs

ANDOVER, Mass., March 18, 2024 (GLOBE NEWSWIRE) — Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a technology company that delivers mission-critical processing power to the edge, today announced the early access program for its RFS1140 direct RF … Read More → "Mercury Announces Early Access Program for New Direct RF Multi-Chip Module Powered by AMD Versal Adaptive SoCs"

Expanded Semiconductor Assembly and Test Facility Database Tracks OSAT and Integrated Device Manufacturers in 670 Facilities, SEMI and TechSearch International Report

Memfault Unveils Device Vitals to Enhance Quality Management of IoT Devices in the Field

March 12, 2024 – Memfault, provider of the first embedded device observability platform, launched Device Vitals to provide plug-and-play visibility into the key indicators of IoT fleet health and product quality. The built-in dashboard makes monitoring firmware stability, battery life, and connectivity easy, providing engineering and product teams with invaluable insights into real-world product performance.

Organizations invest substantial time and capital in product development, yet often encounter a common challenge: once the product is deployed, visibility diminishes, and real-world usage uncovers issues that were impossible to anticipate during testing. This lack of insight poses substantial risks … Read More → "Memfault Unveils Device Vitals to Enhance Quality Management of IoT Devices in the Field"

KYOCERA AVX Releases New Wet Aluminum Electrolytic Capacitors with Commercial-Level Endurance Ratings

Deci AI Unveils Generative AI Platform to Deliver High-Performance AI Models with Unmatched Cost Efficiency and Exceptional Control

TEL AVIV, Israel – March 14, 2024 – Deci, the deep learning company harnessing artificial intelligence (AI) to build AI, today announced the launch of its Generative AI Platform, a comprehensive solution designed to meet the efficiency and privacy needs of enterprises. Deci’s Gen AI platform features a new series of proprietary, fine-tunable large language models (LLMs), an inference engine, and an AI inference cluster management solution.

The first model being released in the series, Deci-Nano, has advanced language and reasoning capabilities that make it ideal for a broad spectrum of applications, such as … Read More → "Deci AI Unveils Generative AI Platform to Deliver High-Performance AI Models with Unmatched Cost Efficiency and Exceptional Control"

TDK presents new dual-die stray-field robust 3D position sensor with analog and switch outputs

  • HAR 3920-2100 (dual die) is a precise Hall-effect position sensor with robust stray-field compensation capabilities with ratiometric analog and switch outputs
  • The sensor is defined as ASIL C- ready and can be integrated in automotive safety-related systems up to ASIL D
  • Target automotive applications include accelerator or brake pedal position detection, clutch position determination, non-contact potentiometer or throttle valve position measurement **

March 14, 2024

TDK Corporation (TSE:6762) further extends its Micronas 3D HAL® position sensor family with the new dual-die sensor HAR 3920-2100* for automotive and … Read More → "TDK presents new dual-die stray-field robust 3D position sensor with analog and switch outputs"

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