Semiconductor devices are prone to failure even after they have been tested, packaged and shipped by the semiconductor vendor. The main factors that contribute to device failure in a system are electrically, environmentally and mechanically induced failures. Because mechanical failures are almost impossible to mitigate at the electrical or electronic design stage the following discussion focuses on electrical and environmental stresses.
 Achieve Greater Design Flexibility and Reduce Costs with ChipletsSponsored by Keysight Chiplets are a new way to build a system-on-chips (SoCs) to improve yields and reduce costs. It partitions the chip into discrete elements and connects them with a standardized interface, enabling designers to meet performance, efficiency, power, size, and cost challenges in the 5 / 6G, artificial intelligence (AI), and virtual reality (VR) era. This white paper will discuss the shift to chiplet adoption and Keysight EDA's implementation of the communication standard (UCIe) into the Keysight Advanced Design System (ADS). |
