editor's blog
Subscribe Now

One + One > Two

The latest, greatest mobile standards appear to be beastly affairs. Added to the old ones, and the number of algorithms that a poor cellphone – even a smart one – has to manage becomes pretty daunting.

And features like MIMO – various permutations and combinations of multiple antennae on the sending and receiving sides – make for an array of possible algorithms that CEVA says can only be managed through a software approach. That is, you load the software you need for the algorithm required at the moment rather than hard-code every possible variant, which would simply take too much silicon.

CEVA attacks this market with their XC architecture, and they recently beefed it up by announcing a multicore version. “OK, big deal,” you might say. “I had one core, now I can have more than one. I could do that before by instantiating more than one.”

Yes and no. Going truly multicore means one more huge addition to the architecture, most of which operates in the background: cache coherency. So even if that was all they had done, that’s a lot of work in its own right.

But they appear to have gone beyond that, adding packet management and scheduling hardware, along with design tools that understands higher-level concepts like queues and buffers. And frankly, at least conceptually, this starts to look a lot like a Cavium OCTEON chip, only with DSPs instead of RISC CPUs.

But, of course, this is IP, not hard silicon (although they have emulation boards). So you can configure things any way you want – including homogeneous and heterogeneous architectures, the latter blending DSPs and CPUs if desired.

They’ve also added floating point support; they point to the MIMO algorithms as a particularly compelling reason to move beyond fixed-point.

So it’s a larger leap than just adding another core or two. You can see more of the speeds and feeds in their release.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

ROHM Automotive Intelligent Power Device (IPD)
Modern automotive applications require a variety of circuit protections and functions to safeguard against short circuit conditions. In this episode of Chalk Talk, Amelia Dalton and Nick Ikuta from ROHM Semiconductor investigate the details of ROHM’s Automotive Intelligent Power Device, the role that ??adjustable OCP circuit and adjustable OCP mask time plays in this solution, and the benefits that ROHM’s Automotive Intelligent Power Device can bring to your next design.
Feb 1, 2024
11,536 views