March 24, 2011
featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
featured paper
 Designing Robust 5G Power Amplifiers for the Real WorldSponsored by Keysight Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems. |
featured chalk talk
Electromagnetic Compatibility (EMC) Gasket Design Considerations
Sponsored by Mouser Electronics and TE Connectivity
Electromagnetic interference can cause a variety of costly issues and can be avoided with a robust EMI shielding solution. In this episode of Chalk Talk, Amelia Dalton chats with Sam Robinson from TE Connectivity about the role that EMC gaskets play in EMI shielding, how compression can affect EMI shielding, and how TE Connectivity can help you solve your EMI shielding needs in your next design.