industry news
Subscribe Now

What to Make of the ‘Quantum Advantage’ at SEMICON West?

 

  • IBM demos its model of the bleeding-edge Q Computer, while the Quantum Economic Development Consortium lays out first steps toward creation of a Quantum Industry Roadmap
  • Dean Kamen introduces quantum leaps for enabling large-scale replacement of human organs
  • New additions to the already announced top-shelf keynotes feature Nate Baxter of TEL, Oreste Donzella of KLA, Victor Peng of Xilinx, Dr. Lisa Su of AMD and Aart de Geus of Synopsys
  • AI Design Forum™ returns to explore “The Future of Computing – from Materials to Systems,” as Electronic Systems Design Alliance co-locates for the first time with SEMICON West

 

MILPITAS, Calif. – June 25, 2019 – SEMICON West participants will gain first look at Quantum Economic Development Consortium (QED-C) roadmapping activities devoted to the pursuit of U.S. leadership in the rapidly emerging global quantum industry – as well as live demonstrations of IBM’s Q Computer model, which showcases quantum computing architecture built upon decades of semiconductor industry advances. Markets that soon may claim staggering leaps from a quantum computational capacity span from automotive to medical, financial and energy.

This opportunity to gauge the impact and timing of quantum advantage on applications for sensing, communication and computing, as well as the opportunities and demands for the microelectronics supply chain, will be among highlights at the 49th SEMICON West, July 9-11 at San Francisco’s Moscone Center.

Boeing and IBM, as well as pure-play quantum companies like Zapata Computing and QCWare and more than 50 other U.S. companies from across the quantum supply chain, have joined the QED-C. The consortium – recently launched with support from the U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) and industry, and managed by SRI International – aims to enable and grow the U.S. commercial quantum industry. Among the many next-generation technologies to be featured, SEMICON West will host a TechTALK where QED-C and industry leaders will detail quantum opportunities – from software to manufacturing. 

Also addressing the promise of quantum advancements will be SEMICON West keynote Dean Kamen, founder of DEKA Research and Development and a legendary inventor, who will explore the leading edge in biofabrication of human organs. Called a “modern-day Edison” by Fortune magazine, Kamen noted “The world needs a quantum leap in the ability to replace body organs, which is where we’re going. And we’re united philosophically with SEMI on the need and effort to cultivate the next wave of talent that’ll help take us there and beyond.”

Prior to their TechTALK, QED-C will be among a select set of news presenters and economic forecasts at the West View Media Lunch and News Conference Tuesday, July 9. 

New SEMICON West Keynotes

Nate Baxter, general manager of Tokyo Electron’s U.S. Development and production group, will address What Does Innovation Look Like in the Era of Industry 4.0.
Oreste Donzella, KLA senior vice president of Global Customer Solutions and Chief Marketing Officer, will speak on Trends in Automotive: The Changing Role of Fab Inspection and Metrology in ‘Zero Defect.’
Victor Peng, Xilinx President and CEO, will present entirely new silicon and software platforms for AI Era applications, designed to deliver order-of-magnitude improvements in performance and performance per watt. 

 

A complete list of keynotes and executive panels is available online. So is information about topics and speakers for the AI Design Forum: The Future of Computing – from Materials to Systems, 9:15 a.m. – 4:40 p.m. Tuesday, July 9. 

As SEMI and the Electronic System Design Alliance evolve to move the industry forward, ES Design West will co-locate with SEMICON West. Platinum Sponsors for SEMICON West are Applied Materials, KLA, Lam Research and TEL. Other top sponsors are AEM Singapore, ASE, Burr & Forman LLP, Edwards, eSilicon Corporation, SAP and Silvaco.

SEMICON West is the culmination of eight progressive conferences that comprise SEMI’s inaugural Technology Leadership Series of the Americas. More information is available on the SEMICON West 2019 website. 

Follow SEMICON West and the AI Design Forum on Twitter: #SEMICONWest, #AIDesignForum and @SEMIconex 

About SEMI     

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Datalogging in Automotive
Sponsored by Infineon
In this episode of Chalk Talk, Amelia Dalton and Harsha Medu from Infineon examine the value of data logging in automotive applications. They also explore the benefits of event data recorders and how these technologies will shape the future of automotive travel.
Jan 2, 2024
16,079 views