industry news
Subscribe Now

Vishay Intertechnology 600 V EF Series Fast Body Diode MOSFET Delivers Industry-Low RDS(ON)*Qg FOM for Power Conversion Applications

Fourth-Generation N-Channel Device Lowers Conduction and Switching Losses, Increases Efficiency

MALVERN, Pa. — Dec. 2, 2020 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new device in its fourth generation of 600 V EF Series fast body diode MOSFETs. Providing high efficiency for telecom, industrial, computing, and enterprise power supply applications, the Vishay Siliconix n-channel SiHH070N60EF slashes on-resistance by 29 % compared with previous-generation devices while delivering 60 % lower gate charge. This results in the industry’s lowest on-resistance times gate charge for devices in the same class, a key figure of merit (FOM) for 600 V MOSFETs used in power conversion applications.

Vishay offers a broad line of MOSFET technologies that support all stages of the power conversion process, from high voltage inputs to the low voltage outputs required to power the latest high-tech equipment. With the SiHH070N60EF and upcoming devices in the fourth-generation 600 V EF Series family, the company is addressing the need for efficiency and power density improvements in two of the first stages of the power system architecture — totem-pole bridgeless power factor correction (PFC) and soft-switched DC/DC converter topologies.

Built on Vishay’s latest energy-efficient E Series superjunction technology, the SiHH070N60EF features low typical on-resistance of 0.061 Ω at 10 V and ultra-low gate charge down to 50 nC. The device’s FOM of 3.1 Ω*nC is 30 % lower than the closest competing MOSFET in the same class. These values translate into reduced conduction and switching losses to save energy. For improved switching performance in zero voltage switching (ZVS) topologies such as LLC resonant converters, the SiHH070N60EF provides low effective output capacitances Co(er) and Co(tr) of 90 pf and 560 pF, respectively. The device’s Co(tr) is 32 % lower than the closest competing MOSFET in the same class.

Offered in the PowerPAK® 8×8 package, the device released today is RoHS-compliant, halogen-free, and designed to withstand overvoltage transients in avalanche mode with guaranteed limits through 100 % UIS testing.

Samples and production quantities of the SiHH070N60EF are available now, with lead times of 10 weeks. Pricing for U.S. delivery only starts at $3.14 per piece in 10,000-piece quantities.

Vishay manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. Serving customers worldwide, Vishay is The DNA of tech.™ Vishay Intertechnology, Inc. is a Fortune 1,000 Company listed on the NYSE (VSH). More on Vishay at www.Vishay.com.

The DNA of tech™ is a trademark of Vishay Intertechnology. PowerPAK is a registered trademark of Siliconix incorporated.

Leave a Reply

featured blogs
Jan 27, 2021
Here at the Cadence Academic Network, it is always important to highlight the great work being done by professors, and academia as a whole. Now that AWR software solutions is a part of Cadence, we... [[ Click on the title to access the full blog on the Cadence Community site...
Jan 27, 2021
Super-size. Add-on. Extra. More. We see terms like these a lot, whether at the drive through or shopping online. There'€™s always something else you can add to your order or put in your cart '€“ and usually at an additional cost. Fairly certain at this point most of us kn...
Jan 27, 2021
Cloud computing security starts at hyperscale data centers; learn how embedded IDE modules protect data across interfaces including PCIe 5.0 and CXL 2.0. The post Keeping Hyperscale Data Centers Safe from Security Threats appeared first on From Silicon To Software....
Jan 25, 2021
In which we meet the Photomath calculator, which works with photos of your equations, and the MyScript calculator, which allows you to draw equations with your finger....

featured paper

Overcoming Signal Integrity Challenges of 112G Connections on PCB

Sponsored by Cadence Design Systems

One big challenge with 112G SerDes is handling signal integrity (SI) issues. By the time the signal winds its way from the transmitter on one chip to packages, across traces on PCBs, through connectors or cables, and arrives at the receiver, the signal is very distorted, making it a challenge to recover the clock and data-bits of the information being transferred. Learn how to handle SI issues and ensure that data is faithfully transmitted with a very low bit error rate (BER).

Click here to download the whitepaper

Featured Chalk Talk

Use of Advanced Sensors in Smart Industry Applications

Sponsored by Mouser Electronics and STMicroelectronics

In industrial systems, sensors can give us real-time information about the condition and operation critical machinery. By monitoring vibration, temperature, and other factors, we can get early warning of failures and do predictive maintenance - avoiding costly downtime. In this episode of Chalk Talk, Amelia Dalton chats with Manuel Cantone of ST Microelectronics about the SensorTile Wireless Industrial Node - an integrated solution that makes industrial monitoring a snap.

More information about STMicroelectronics STWIN SensorTile Wireless Industrial Node