industry news
Subscribe Now

Vishay Intertechnology 30 V Symmetric Dual MOSFETs in PowerPAIR® 3x3FS Package Achieve 98 % Efficiency

Requiring 63 % Less PCB Space Than the PowerPAIR 6x5F Package, Space-Saving Devices Reduce Component Counts and Simplify Designs

MALVERN, Pa. — Jan. 23, 2023 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced two new 30 V symmetric dual n-channel power MOSFETs that combine high and low side TrenchFET® Gen V MOSFETs in a single 3.3 mm by 3.3 mm PowerPAIR® 3x3FS package. For power conversion in computing and telecom applications, the Vishay Siliconix SiZF5300DT and SiZF5302DT increase efficiency while reducing component counts and simplifying designs.

The dual MOSFETs released today can be used in place of two discrete devices in the PowerPAK® 1212 package — saving 50 % board space — while offering a 63 % smaller footprint than dual MOSFETs in the PowerPAIR 6x5F. The MOSFETs provide designers with space-saving solutions for synchronous buck converters, point of load (POL) conversion, and DC/DC modules in laptops with USB-C power delivery, servers, DC cooling fans, and telecom equipment. In these applications, the high and low side MOSFETs of the SiZF5302DT form an optimized combination for 50 % duty cycles and best in class efficiency, in particular from 1 A to 4 A, while the SiZF5300DT provides an optimized combination for heavy loads in the 12 A to 15 A range.

The SiZF5300DT and SiZF5302DT leverage Vishay’s 30 V Gen V technology for optimal on-resistance and gate charge. The SiZF5300DT provides typical on-resistance of 2.02 mΩ at 10 V and 2.93 mΩ at 4.5 V, while the SiZF5302DT features on-resistance of 2.7 mΩ at 10 V and 4.4 mΩ at 4.5 V. Typical gate charge for the MOSFETs at 4.5 V is 9.5 nC and 6.7 nC, respectively. The resulting ultra low on-resistance times gate charge — a key figure of merit (FOM) for MOSFETs used in power conversion applications — is 35 % lower than that of previous-generation solutions with similar on-resistance. For high frequency switching applications, the result is a 2 % increase in efficiency, allowing for efficiency of 98 % at 100 W.

Comparison to Previous-Generation Solution

Specification / device number

SiZF5302DT
(Gen V)

Previous solution
(Gen IV)

SiZF5302DT vs. previous solution comparison

Package

PowerPAIR 3x3FS

PowerPAIR 6x5F

63 %

VDS (V)

30

30

RDS(ON) typ.
@ 4.5 V (mΩ)

4.4 (Channel 1)
4.4 (Channel 2)

4.0 (Channel 1)
1.2 (Channel 2)

Qg @ 4.5 V (nC)

6.7 (Channel 1)
6.7 (Channel 2)

11 (Channel 1)
46 (Channel 2)

FOM (mΩ*nC)

29 (Channel 1)
29 (Channel 2)

44 (Channel 1)
54 (Channel 2)

35 % 
46 % 

Efficiency
@ 20 VIN / 12.5 VOUT /
800 kHZ / 100 W

98 %

96 %

2 %

The devices’ flip-chip technology enhances thermal dissipation, while their unique pin configuration enables a simplified PCB layout and supports shortened switching loops to minimize parasitic inductance. The SiZF5300DT and SiZF5302DT are 100 % Rg- and UIS-tested, RoHS-compliant, and halogen-free.

Device Specification Table:

Part number

SiZF5300DT

SiZF5302DT

VDS (V)

30

30

VGS (V)

+16 / -12

+16 / -12

RDS(on) typ. (mΩ) @

10 V

2.02

2.7

4.5 V

2.93

4.4

Qg (Typ.) @ 4.5 V (nC)

9.5

6.7

ID (A) @

TA = 25 °C

125

100

TA = 70 °C

100

80

Samples and production quantities of the SiZF5300DT and SiZF5302DT are available now. Lead time information may be requested from your Vishay sales contact or by email to pmostechsupport@vishay.com.

Vishay manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. Serving customers worldwide, Vishay is The DNA of tech.™ Vishay Intertechnology, Inc. is a Fortune 1,000 Company listed on the NYSE (VSH). More on Vishay at www.Vishay.com.

Leave a Reply

featured blogs
Jan 27, 2023
Wow, it's already the last Friday in January, so time for one of my monthly update posts where I cover anything that doesn't justify its own full post or which is an update to something I wrote about earlier. Automotive Security I have written about automotive secur...
Jan 26, 2023
By Slava Zhuchenya Software migration can be a dreaded endeavor, especially for electronic design automation (EDA) tools that design companies… ...
Jan 24, 2023
We explain embedded magnetoresistive random access memory (eMRAM) and its low-power SoC design applications as a non-volatile memory alternative to SRAM & Flash. The post Why Embedded MRAMs Are the Future for Advanced-Node SoCs appeared first on From Silicon To Software...
Jan 19, 2023
Are you having problems adjusting your watch strap or swapping out your watch battery? If so, I am the bearer of glad tidings....

featured video

Synopsys 224G & 112G Ethernet PHY IP OIF Interop at ECOC 2022

Sponsored by Synopsys

This Featured Video shows four demonstrations of the Synopsys 224G and 112G Ethernet PHY IP long and medium reach performance, interoperating with third-party channels and SerDes.

Learn More

featured chalk talk

Machine Learning at the Edge: Applications and Challenges

Sponsored by Mouser Electronics and Silicon Labs

Machine learning at the TinyEdge is the way of the future but how we incorporate machine learning into our designs can take a variety of different forms. In this episode of Chalk Talk, Amelia chats with Dan Kozin from Silicon Labs about how you can add machine learning to your next design. They investigate what machine learning workflows look like, what machine learning tools you can utilize and the key challenges you will encounter as a machine learning developer.

Click here for more information about Silicon Labs Series 2 Wireless SoCs