industry news
Subscribe Now

UnitedSiC introduces Kelvin connection parts into UF3C “FAST” FET series

December 3, 2018, Princeton, New Jersey: UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, expands its UF3C FAST Series product offering by introducing an additional range of 650 V and 1200 V high-performance silicon carbide FETs in a TO-247-4L 4-pin Kelvin Sense package option. Based on an efficient cascode configuration, this new series provides designers with very fast switching, high-power devices in a package capable of high-power dissipation.

The Kelvin package avoids gate ringing and false triggering which would otherwise require slowing of switching speeds to manage the large common source inductance of 3-leaded packages. The 4-leaded Kelvin connection packages offer maximum operating temperatures of 175°C, excellent reverse recovery, low gate charge along with up to 2X lower switching losses.

Designers of Totem Pole PFC stages, LLC and Phase Shifted Full Bridge converters, used in EV chargers, telecom and server power applications can achieve new levels of switching speed, efficiency, ease of use, and power density with the new UF3C series.

Compared with other wide band-gap technologies, the SiC cascode devices offer standard 12V gate drive, and have assured avalanche ratings (100 percent production-tested). The 4-terminal packages, which form part of the UF3C FAST series, offer easy screw or clamp mounting with very low junction-to case-thermal resistance allowing lower temperature rise for a given power dissipation or higher power operation, taking advantage of the high junction temperature capabilities of SiC.

“The expanded UF3C FAST Series cascodes in 4-leaded TO-247 packages are simple to use, even at higher switching frequencies,” said Anup Bhalla, VP Engineering at UnitedSiC. “They offer top efficiency and excellent thermal dissipation in high power designs.”

The range includes the following part numbers: UF3C120040K4S (1200 V / 40 mΩ), UF3C120080K4S (1200 V / 80 mΩ), UF3C065030K4S (650 V / 30 mΩ), UF3C065040K4S (650 V / 40 mΩ) and UF3C065080K4S (650 V 80 mΩ).

Data sheets and other resources are available at https://unitedsic.com/cascodes/.

Price and availability

Prices range from $11 for the UF3C065080K4S to $25 for the UF3C120040K4S at 1,000 pcs quantities. Stock is available at Mouser and other local distributors.  

Leave a Reply

featured blogs
May 8, 2024
Learn how artificial intelligence of things (AIoT) applications at the edge rely on TSMC's N12e manufacturing processes and specialized semiconductor IP.The post How Synopsys IP and TSMC’s N12e Process are Driving AIoT appeared first on Chip Design....
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Enabling IoT with DECT NR+, the Non-Cellular 5G Standard
In the ever-expanding IoT market, there is a growing need for private, low cost networks. In this episode of Chalk Talk, Amelia Dalton and Heidi Sollie from Nordic Semiconductor explore the details of DECT NR+, the world’s first non-cellular 5G technology standard. They investigate how this self-healing, decentralized, autonomous mesh network can help solve a variety of IoT connectivity issues and how Nordic is helping designers take advantage of DECT NR+ with their nRF91 System-in-Package family.
Aug 17, 2023
31,644 views