industry news
Subscribe Now

UnitedSiC adds 7 SiC FETs to 650V product portfolio

May 7th, 2018, Princeton, New Jersey and Nuremberg, Germany: UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, has added seven new TO220-3L and D2PAK-3L device/package combinations to its UJ3C (general purpose) and UF3C (hard switched) series of 650V SiC FETs.

These new devices provide new levels of high-voltage power performance in the fast growing data center server, 5G base station, and electric vehicle markets, where they will be used in power supplies, telecom rectifiers, and on-board chargers respectively. The new devices will appeal to designers who prefer a 3-lead, TO220 or D2PAK package option, yet are still looking to enhance power performance in power-factor correction circuits, LLC resonant converters, and phase-shifted full-bridge converters.

Unique to UnitedSiC’s UJ3C and UF3C FET portfolio is its true “drop-in replacement” functionality. Designers can significantly enhance system performance, without the need to change gate drive voltage, by replacing their existing Si IGBTs, Si FETs, SiC MOSFETs or Si superjunction devices with the UnitedSiC FETs.

Both series of SiC FETs are based on UnitedSiC’s unique ‘cascode’ circuit configuration, in which a normally-on SiC JFET is co-packaged with a Si MOSFET to produce a normally-off SiC FET device that has standard gate-drive characteristics. As a result, existing systems upgraded with the UnitedSiC “drop-in replacement” FETs can expect a performance increase with lower conduction and switching losses, enhanced thermal properties and integrated gate ESD protection. In the case of new designs, the UnitedSiC FETs deliver increased switching frequencies to gain substantial system benefits in both efficiency and reduction in size, and cost of passive components, such as magnetics and capacitors.

The three-leaded, industry-standard TO220-3L package offers enhanced thermal characteristics made possible by UnitedSiC’s sintered-silver packaging technology. New products available in this package include the UJ3C device with RDS(on) values of 30 and 80mohms, and the UF3C device with an RDS(on) spec of 40mohms.

The three-leaded, industry-standard D2PAK-3L targets surface mount designs and is certified to IPC and JEDEC’s Moisture Sensitivity Level 1. New products available in this package include the UJ3C device with RDS(on) specs of 30 and 80mohms, and UF3C devices with RDS(on) specs of 30 and 40mohms.

Select devices are also available in automotive versions that meet AEC-Q101.

Data sheets and other resources are available at https://unitedsic.com/cascodes/.

Price and availability
Dependent upon RDS(on) values, prices range from $5.18 to $14.35 each for the D2PAK-3L options and from $5.18 to $13.79 each for the TO220-3L options at 1,000 pcs quantities. Devices are in stock at UnitedSiC franchised distributors, including Mouser and Richardson Electronics.

Leave a Reply

featured blogs
Mar 28, 2024
The difference between Olympic glory and missing out on the podium is often measured in mere fractions of a second, highlighting the pivotal role of timing in sports. But what's the chronometric secret to those photo finishes and record-breaking feats? In this comprehens...
Mar 26, 2024
Learn how GPU acceleration impacts digital chip design implementation, expanding beyond chip simulation to fulfill compute demands of the RTL-to-GDSII process.The post Can GPUs Accelerate Digital Design Implementation? appeared first on Chip Design....
Mar 21, 2024
The awesome thing about these machines is that you are limited only by your imagination, and I've got a GREAT imagination....

featured video

We are Altera. We are for the innovators.

Sponsored by Intel

Today we embark on an exciting journey as we transition to Altera, an Intel Company. In a world of endless opportunities and challenges, we are here to provide the flexibility needed by our ecosystem of customers and partners to pioneer and accelerate innovation. As we leap into the future, we are committed to providing easy-to-design and deploy leadership programmable solutions to innovators to unlock extraordinary possibilities for everyone on the planet.

To learn more about Altera visit: http://intel.com/altera

featured chalk talk

OPTIGA™ TPM SLB 9672 and SLB 9673 RPI Evaluation Boards
Sponsored by Mouser Electronics and Infineon
Security is a critical design concern for most electronic designs today, but finding the right security solution for your next design can be a complicated and time-consuming process. In this episode of Chalk Talk, Amelia Dalton and Andreas Fuchs from Infineon investigate how Infineon’s OPTIGA trusted platform module can not only help solve your security design concerns but also speed up your design process as well.
Jun 26, 2023
31,559 views