industry news
Subscribe Now

TE Connectivity launches VITA 87 High Density Circular MT Connectors

New product line offers higher density for next-generation embedded systems

HARRISBURG, Pa. – Feb 07, 2024 – TE Connectivity (TE), a world leader in connectivity and sensors, continues to be at the vanguard of the industry with the design and optimization of military aerospace and defense embedded systems following the launch of its new VITA 87 High Density Circular MT Connectors.

This new product line features 12 to 24 fiber options, housing up to 96 fibers within a compact size 15 shell with 4 MTs – a stark contrast to the J4 interconnect in SOSA open systems architecture, which fits just 11 fibers in a larger size 19 shell. By providing drastically increased fiber counts within a smaller footprint adhering to standard dimensions, TE’s VITA 87 standard product line helps enable next-generation systems to meet stringent size, weight and power requirements while supporting the high bandwidth needs of emerging data-intensive capabilities.

“Previous market solutions used much larger circular MIL Spec connectors; however, newer architectures demand much higher density to fit into industry-standard card and backplane slots,” said Doug Rhode, engineer in TE’s Aerospace, Defense & Marine Division. “The new VITA 87 High Density Circular MT Connectors address this need and offer a significant improvement over the options available today.”

The new product line meets the VITA 87 and the SOSA Technical Standards, to help ensure TE customers’ supply demands can be achieved and they can design their systems confidently. These new connectors, available in both physical contact and lensed versions, cater to a diverse array of high-density applications. Their versatility extends from MIL fiber optics cable assemblies to optical add-on and option cards, as well as to a range of ruggedized uses involving the MIL-STD 38999 interface.

“The launch of the VITA 87 High Density Circular MT Connectors is an example of TE’s commitment and ability to develop industry-leading connectivity solutions,” ​​said Brent Hatfield, product manager in TE’s Aerospace, Defense & Marine Division. “And as the industry continues to experience rapidly growing bandwidth requirements, TE will continue to focus on advancing our interconnect capabilities to enable the high-performance embedded systems our customers require now and into the future.”

For more information on TE’s VITA 87 High Density Circular MT Connectors visit here.

TE Connectivity is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, renewable energy, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 8,000 engineers, working alongside customers in approximately 140 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at and on LinkedInFacebookWeChat, Instagram and X (formerly Twitter).

Leave a Reply

featured blogs
Feb 22, 2024
The new Cadence training website is online! This newly redesigned website provides an overview of our well-respected training methods and courses, plus offerings that might be new to you. Modern design and top-of-the-page navigation make it easy to find just what you need'”q...
Feb 15, 2024
This artist can paint not just with both hands, but also with both feet, and all at the same time!...

featured video

Tackling Challenges in 3DHI Microelectronics for Aerospace, Government, and Defense

Sponsored by Synopsys

Aerospace, Government, and Defense industry experts discuss the complexities of 3DHI for technological, manufacturing, & economic intricacies, as well as security, reliability, and safety challenges & solutions. Explore DARPA’s NGMM plan for the 3DHI R&D ecosystem.

Learn more about Synopsys Aerospace and Government Solutions

featured paper

How to Deliver Rock-Solid Supply in a Complex and Ever-Changing World

Sponsored by Intel

A combination of careful planning, focused investment, accurate tracking, and commitment to product longevity delivers the resilient supply chain FPGA customers require.

Click here to read more

featured chalk talk

AI/ML System Architecture Connectivity Solutions
Sponsored by Mouser Electronics and Samtec
In this episode of Chalk Talk, Amelia Dalton and Matthew Burns from Samtec investigate a variety of crucial design considerations for AI and ML designs, the role that AI chipsets play in the development of these systems, and why the right connectivity solution can make all the difference when it comes to your machine learning or artificial intelligence design.
Oct 23, 2023