industry news
Subscribe Now

TE Connectivity helps improve temperature sensor accuracy with custom packaging for platinum thin film elements

Elements provide highly accurate and stable performance in demanding applications

BERYWN, Pa. – Jan. 5, 2020 – Temperature sensors are one of the most widely applied measurement technologies. As technology advances and industrial processes become more complex, devices continue to require a higher level of accuracy in temperature sensing across multiple industries. With decades of industry experience and custom packaging capabilities, TE Connectivity (TE), a world leader in connectivity and sensors, has been able to provide critical temperature sensing solutions for a variety of applications. In an effort to continue to meet customer demand, TE is now offering custom packaging for resistance temperature detectors (RTD) platinum thin film elements, which provide a highly accurate and stable performance in demanding applications that require fast and precise feedback as well as energy efficiency and stability. With globally interchangeable drop-in elements, TE is able to design and develop probes and assemblies with custom packaging for a variety of applications to meet customer specifications.

“There is a growing demand for temperature sensors that provide high accuracy and precision measurement with the ability to be easily designed into new and existing applications,” said Noel Burke, senior manager, product management, TE Connectivity. “TE’s custom packaging for RTD platinum thin film elements allows us to elevate our existing sensor solutions capabilities and better serve our customers, especially those in the industrial, medical and automotive industries.”

TE’s RTD platinum thin film elements offer the following key benefits:

  • Highly accurate and stable: The resistance of the platinum thin film elements adjusts in a linear fashion to changes in temperature to provide accurate, stable measurement in extreme environments with accuracy ranges from ±0.1K to ±0.6K at 0°C. These elements have a rugged construction of glass that minimizes field failures and need for replacement.
  • Wide operating temperature range: RTD platinum elements provide stability at high temperatures with low drift over lifetime and are engineered to withstand temperatures from -200°C up to +600°C. Specific temperature ranges vary depending on the accuracy class and type of lead wires. The gold coated nickel lead wire is available for higher temperature operation and for welding applications, while the silver lead wire is available for lower temperature operation and for applications that involve soldering.
  • Compact design: Platinum thin film elements offer a small outline and low mass suited for applications with rapid temperature changes. Outline dimensions are available in four standard sizes and allow for easy packaging in a variety of housing styles. These elements offer a fast response time to increase efficiency with different accuracy classes available per DIN EN 60751. 

For more information TE’s sensors business, visit te.com/sensors.

Link to product information:

Product Photo

Product Video

Datasheet

Trendpaper

Solution Guide

About TE Connectivity

TE Connectivity is a $12 billion global industrial technology leader creating a safer, sustainable, productive and connected future. Our broad range of connectivity and sensor solutions, proven in the harshest environments, enable advancements in transportation, industrial applications, medical technology, energy, data communications and the home. With approximately 80,000 employees, including more than 7,500 engineers, working alongside customers in approximately 140 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedInFacebookWeChat and Twitter.

Leave a Reply

featured blogs
Apr 24, 2026
A thought experiment in curiosity, confusion, and cosmic consequences....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

GaN for Humanoid Robots
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Eric Persson and Amelia Dalton explore why power is the key driver for efficient and reliable robot movements and how GaN technologies can help motor control solutions be more compact, integrated and efficient. They also investigate the role of field-oriented control in humanoid robotic applications and why the choice of a GaN power transistor can make all the difference in your next humanoid robot project!
Apr 20, 2026
4,042 views