industry news
Subscribe Now

TDK offers snap-in capacitors with increased compactness for general-purpose applications

April 23, 2024

TDK Corporation (TSE:6762) announces the new EPCOS B43659 series of snap-in aluminum electrolytic capacitors. This is the next generation of ultra-compact general-purpose components for voltages of 450 V (DC) featuring an extremely high CV product. It provides the same features and serves the same applications as the previous series; however, the B43659 is much more compact. In case sizes of only 22 mm x 25 mm to 35 mm x 50 mm (D x H), these components achieve capacitances ranging from 140 µF to 1030 µF. In addition to the standard versions with 2 terminals, versions with 3 terminals are also available to ensure correct installation.

Essential performance features include a high ripple current capability of up to 7.01 A (120 Hz, +60 °C) and a service life of at least 2000 h at a maximum operating temperature of +105 °C. Accurate lifetime calculation under application-specific conditions is quick and easy with the web-based AlCap Tool (www.tdk-electronics.tdk.com/en/alcap_tool).

Due to their high reliability and compact size, these RoHS-compliant aluminum electrolytic capacitors can be used in a wide range of applications, such as switched-mode power supplies, frequency converters, uninterruptible power supplies (UPS), medical equipment, and solar inverters.

—–

Main applications

  • Power supplies
  • Frequency converters
  • Uninterruptible power supplies
  • Medical equipment
  • Solar inverters
  • Not for automotive applications unless otherwise specified

Main features and benefits

  • Extremely high CV product, ultra-compact
  • High reliability
  • High ripple current capability
  • Versions with 3 terminals to ensure correct insertion
  • RoHS-compliant

About TDK Corporation

TDK Corporation is a world leader in electronic solutions for the smart society based in Tokyo, Japan. Built on a foundation of material sciences mastery, TDK welcomes societal transformation by resolutely remaining at the forefront of technological evolution and deliberately “Attracting Tomorrow.” It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK‘s comprehensive, innovation-driven portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices, magnetic heads and more. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2023, TDK posted total sales of USD 16.1 billion and employed about 103,000 people worldwide.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

USB Power Delivery: Power for Portable (and Other) Products
Sponsored by Mouser Electronics and Bel
USB Type C power delivery was created to standardize medium and higher levels of power delivery but it also can support negotiations for multiple output voltage levels and is backward compatible with previous versions of USB. In this episode of Chalk Talk, Amelia Dalton and Bruce Rose from Bel/CUI Inc. explore the benefits of USB Type C power delivery, the specific communications protocol of USB Type C power delivery, and examine why USB Type C power supplies and connectors are the way of the future for consumer electronics.
Oct 2, 2023
26,916 views