| Nuremberg, Germany – March 09, 2026: Octavo Systems, a leader in system integration technology, will showcase its latest System-in-Package (SiP) technology at Embedded World 2026, a trade show taking place March 10–12 at the Nuremberg Exhibition Centre in Germany. Attendees are invited to visit the company at Booth 3-160 to experience live product demonstrations, explore how SiP technology is transforming the way engineering teams design embedded systems, and meet the Octavo team.
Embedded World is the world’s leading exhibition and conference for embedded systems, attracting thousands of engineers and technology decision-makers from around the globe. Octavo Systems will use this key platform to highlight how its SiP solutions help engineering teams simplify complex designs, reduce board space, and bring products to market faster. Visitors to Octavo Systems’ booth will have the opportunity to see the OSD62x-PM, a compact 9mm × 14mm System-in-Package. The OSD62x-PM integrates a Texas Instruments AM62x processor, DDR4 memory and passive components into a single, space-saving solution.
Thanks to the company’s strategic industry partnerships, the OSD62x-PM is priced below the cost of sourcing and assembling equivalent discrete components – delivering meaningful savings in both development time and bill of materials (BOM) cost. For engineering teams working under tight space and budget constraints, the OSD62x-PM represents a compelling path to simplified, cost-effective design. Embedded World attendees will also get an exclusive first look at the forthcoming OSD32MP2 family – Octavo Systems’ next-generation SiP lineup engineered to deliver enhanced performance and greater flexibility for space-constrained applications. This highly anticipated product line is set to push the boundaries of what is achievable in a compact footprint. “Octavo Systems is committed to solving the real challenges faced by embedded design teams – whether complexity, board space, or time to market” explained Greg Sheridan, Vice President Marketing. “Embedded World 2026 is the perfect stage for us to show the industry how our System-in-Package technology can address these challenges head-on, and we’re excited to share a preview of what’s coming next with the OSD32MP2 family.” For more information, including detailed specifications and ordering details, please visit https://octavosystems. |
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| About Octavo Systems
Octavo Systems is at the forefront of System-in-Package technology, dedicated to making electronic design simpler, faster, and more cost-effective. With a focus on integrating complex systems into compact, efficient packages, Octavo Systems is paving the way for the future of electronics design. |
