industry news
Subscribe Now

STMicroelectronics Unveils Next-Generation MEMS Accelerometer for High-Performance Automotive Applications

Geneva, April 26, 2021 – The STMicroelectronics AIS2IH three-axis linear accelerometer brings enhanced resolution, temperature stability, and mechanical robustness to non-safety automotive applications including anti-theft, telematics, infotainment, tilt/inclination measurement, and vehicle navigation. It also paves the way to new performance-demanding applications in automotive, medical, and industrial segments.

Leveraging ST’s leading positions in both MEMS and automotive technologies, the AIS2IH ensures market-leading reliability while delivering high-performance motion sensing over a wide -40ºC to +115ºC operating temperature range. Moreover, the accelerometer features ultra-low power consumption in a compact LGA-12 land grid array package, at an ultra-competitive price.

With five different operating modes, including one high-performance mode (HPM) and four low-power modes (LPM), the device supports switching between modes on the fly to optimize resolution and power consumption for the exact application requirements at any time.

Together, the extended operating-temperature range with enhanced performance and cost-effectiveness enable the AIS2IH to address emerging automotive applications such as digital drive recorders, driver monitoring, vertical level sensing in vehicle suspension, and door automation. The sensor is also suited to industrial IoT (IIoT) applications such as 5G smart antennas as well as sensitive medical applications like pacemakers, which require ultra-low power consumption, compact size, and high resolution at uncompromised reliability.

ST’s new automotive accelerometer has user-selectable full scales of ±2g, ±4g, ±8g, and ±16g, and is capable of measuring accelerations with output data rates (ODR) configurable in the range from 1.6Hz to 1.6kHz, with embedded configurable digital low-pass and high-pass filters. Typical noise density is 90µg/√Hz when operating in high-performance mode. The operating current at 3V is 110μA in HPM and 0.67μA in LPM at 1.6Hz. The embedded 32-level FIFO and the motion- and activity-detection functions contribute to keeping the system-level power consumption within a tight budget.

The AEC-Q100 qualified AIS2IH is sampling now in 2mm x 2mm LGA package with wettable flanks. Pricing starts at $1.50 for orders of 1000 pieces.

For more information please go to www.st.com/mems

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Connectivity Solutions for Smart Trailers
Smart trailers can now be equipped with a wide variety of interconnection systems including wire-to-wire, wire-to-board, and high-speed data solutions. In this episode of Chalk Talk, Amelia Dalton and Blaine Dudley from TE Connectivity explore the evolution of smart trailer technology, the different applications within a trailer where connectivity would be valuable, and how TE Connectivity is encouraging innovation in the world of smart trailer technology.
Oct 6, 2023
25,848 views