industry news
Subscribe Now

STMicroelectronics’ Single-Chip Balun for sub-1GHz Radio Practically Makes Antenna-Matching/Filtering Circuitry Disappear

Geneva, December 18, 2017 — STMicroelectronics has introduced a matched balun for its S2-LP 868-927MHz low-power radio transceiver to help engineers save board space and minimize RF-circuit design challenges in size- and cost-conscious products like IoT sensors, smart meters, alarms, remotes, building automation, and industrial controls.
 
The 3.26mmBALF-SPI2-01D3 integrates all the impedance-matching and filtering components needed to connect an antenna to the S2-LP radio, replacing a conventional network of 16 discrete capacitors and inductors that can occupy up to 100mm2 of board real-estate — a footprint reduction of more than 96%.
 
In addition to saving space, circuit design is greatly simplified, with no need to select component values or tackle exacting layout challenges. Fully optimized for the S2-LP, the balun comes with placement and connection recommendations that are tested and verified and can be directly replicated to maximize RF performance.
 
The BALF-SPI2-01D3 is the latest in ST’s family of integrated baluns. There are now 16 devices, in package sizes down to 0.8mm2 and just 0.56mm high after reflow, for use with ST’s sub-1GHz or Bluetooth® low energy 2.4GHz radios, as well as with various transceivers from other manufacturers.
 
As a critical enabling technology for these highly integrated matching devices, ST’s Integrated Passive Device (IPD) on non-conductive glass-substrate ensures low RF signal losses, with low amplitude and phase imbalances, ultimately resulting in superior RF-subsystem performance and longer operating life for battery-powered devices. With the increasing importance of connected, smart objects to support consumer lifestyles and to enhance business efficiency and innovation of new services in commercial, energy, and industrial sectors, designers can gain a competitive edge in these fast-growing markets by using ST’s integrated baluns to trim product dimensions, maximize performance, and shorten development cycles.
 
The BALF-SPI2-01D3 is in production now, in a 6-bump 2.1mm x 1.55mm chip-scale package, priced from $0.176 for orders of 500 units.
 
For further information please visit www.st.com/balf-spi2-01d3-news

Leave a Reply

featured blogs
Dec 16, 2018
https://youtu.be/izP9iUskcXQ Made at the Cadence Marketing Holiday Party (camera Sean) Monday: RISC-V: Real Products in Volume Tuesday: IEDM: All About Interconnect Wednesday: The Conway... [[ Click on the title to access the full blog on the Cadence Community site. ]]...
Dec 13, 2018
In November, we continued our mobile updates to the website, released a couple of new content experiences, and made placing sample requests even easier. Read more below on these and the rest of the major updates to Samtec.com for November 2018. Continued Improvements to our M...
Dec 10, 2018
With Apple'€™s '€œWearable'€ category of sales setting a new record this September with growth over 50%, and FitBit seeing growth in both trackers......
Nov 14, 2018
  People of a certain age, who mindfully lived through the early microcomputer revolution during the first half of the 1970s, know about Bill Godbout. He was that guy who sent out crudely photocopied parts catalogs for all kinds of electronic components, sold from a Quon...