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iWave is excited to announce the launch of the iW-RainboW-G61M System on Module, powered by NXP® Semiconductors i.MX 95 applications processor. Built on the SMARC v2.1.1 standard, the SoM provides product designers with scalability and modularity. The System on Modules and evaluation kits from iWave will be available for evaluation starting in April 2024.

The SoM helps you leverage the multi-core architecture of the NXP i.MX 95 applications processor family, offering high-speed data processing alongside secure, real-time, and low-power modes. The SoM offers high-speed connectivity options such as 10GbE, USB 3, PCIe® Gen 3, together with Wi-Fi 6 and Bluetooth 5.3 wireless connectivity. The System on Module caters to a wide range of products and applications ranging from automotive connectivity and infotainment systems to Industry 4.0 applications.

The flex domains on the NXP i.MX 95 SoC allows engineers to mix which pieces of IP they want to use in a particular domain. The Multimedia block includes an Arm Mali 3D GPU core, but also an independent 2D GPU with a real-time blend engine. The i.MX 95 SoC is also NXP’s first applications processor to support LPDDR5 DRAM, enabling increased bandwidth for applications leveraging the embedded workload accelerators

Key features of iW-RainboW-G61M: 

  • NXP i.MX 95 applications processor
  • 6 x Cortex-A55 @ up to 2GHz
  • 1 x M33 core @333MHz
  • 1 x M7 core @800MHz
  • eIQ® Neutron NPU up to 2.0 TOPS
  • 16GB LPDDR5
  • 16Mb QSPI Flash and
  • 16GB eMMC Flash
  • Wi-Fi 6 & BT 5.3 Connectivity
  • 2x LVDS, 1x MIPI CSI, 1x HDMI
  • 2x Gigabit Ethernet, 2x PCIe 3.0
  • 4x USB 2.0 Host, 1x USB 3.0 OTG
  • 1x SerDes (10G), 2x CAN, 3x I2C, 1x SD (4bit)
  • SMARC v2.1.1 Standard (82mm x 50mm)
  • Linux 6.6 BSP Support
  • i.MX 95 SAMRC PR image

The SoM is available in Industrial Grade with the associated BSP support and regular software updates from iWave. iWave assures customers a SoM product longevity of 15+ years and complementary ODM models on hardware customization, software customization, and mechanical and thermal analysis.

“iWave is excited to launch the iW-RainboW-G61M System on Module in Embedded World 2024, offering designers a powerful SoC with advanced 3D graphics, neural processing, and a new flex domain architecture, “said Immanuel Rathinam, Vice President – System on Modules at iWave. As a premier partner with early access to NXP technology, iWave iW-RainboW-G61M System on Module, powered by the NXP i.MX 95 applications processor, enables customers to leverage the powerful features of the latest SoC from NXP.”

“The NXP i.MX 95 is designed to deliver the next generation of edge computing performance for the industrial IoT market;” stated Robert Thompson, Director, Secure Connected Edge ecosystem, NXP. “iWave has a long history of developing advanced system on modules based on NXP’s i.MX applications processors. The iW-RainboW-G61M not only extends this collaboration but delivers the features of the i.MX 95 in a module that will accelerate time to market for customers.”

Complementing our System on Module, iWave enables customers with NXP i.MX 95 SoM evaluation kits with the latest software packages to expedite their evaluation and time to market.

Evaluation Kit Features: 

  • 2x Gigabit Ethernet Jack
  • 1x PCIe port & M.2 KEY B PCIe
  • 2x USB 2.0 Host Type-A, 1x USB 2.0 OTG Type microAB
  • USB 3.0 Host Type-A/ Type-C OTG
  • 1x Standard SD
  • HDMI-Type A Connector
  • 20pin LVDS Connector
  • MIPI CSI Camera Connector
  • 2x Audio In & Out Jack through I2S Codec
  • 2x CAN Header
  • i.MX 95 SAMRC Development kit image

Click here for more details on the NXP i.MX 95-based System on Module and Evaluation Kit.

iWave is an embedded systems engineering and solutions company designing solutions for the Industrial, Medical, and Automotive vertical markets. Building on a core competency of embedded design and manufacturing, iWave boasts an extensive portfolio of NXP i.MX applications processor powered System on Modules & Single Board Computers enabling customers in their product development journey.

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