industry news
Subscribe Now

STMicroelectronics Manufactures First 200mm Silicon Carbide Wafers

Transition to 200m wafers marks milestone in capacity build-up to support automotive and industrial markets in the electrification of their systems and products

Geneva, Switzerland, July 27, 2021 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced it has manufactured the first 200mm (8-inch) Silicon-Carbide (SiC) bulk wafers for prototyping next-generation power devices from its facility in Norrköping, Sweden. The transition to 200mm SiC wafers marks an important milestone in the capacity build-up for ST’s customer programs in automotive and industrial sectors and will consolidate ST’s lead in the disruptive semiconductor technology that allows for smaller, lighter, and more efficient power electronics with a lower total cost of ownership.

Among the first in the world, ST’s initial 200mm SiC wafers are also very high quality, with minimal yield-impacting and crystal-dislocation defects. The low defectivity has been achieved by building on the excellent know-how and expertise in SiC ingot growth technology developed by STMicroelectronics Silicon Carbide A.B. (formerly Norstel A.B., which ST acquired in 2019). In addition to meeting the quality challenge, the transition to 200mm SiC substrates requires a step forward in manufacturing equipment and the overall support ecosystem performance. ST, in collaboration with technology partners covering the entire supply chain, is developing its own 200mm SiC manufacturing equipment and processes.

ST currently manufactures its leading-edge, high-volume STPOWER SiC products on two 150mm wafer lines in its fabs in Catania (Italy) and Ang Mo Kio (Singapore) and performs assembly and test at its back-end sites in Shenzhen (China) and Bouskoura (Morocco). This milestone comes as part of the Company’s planned move to more advanced, cost-efficient 200mm SiC volume production. This transition is within the Company’s ongoing plan to build a new SiC substrate plant and source over 40% of its SiC substrates internally by 2024.

The transition to 200mm SiC wafers will bring substantial advantages to our automotive and industrial customers as they accelerate the transition towards electrification of their systems and products”, said Marco Monti, President Automotive and Discrete Group, STMicroelectronics. It is important in driving economies of scale as product volumes ramp. Building robust know-how in our internal SiC ecosystem across the full manufacturing chain, from high-quality SiC substrates to large-scale front- and back-end production, boosts our flexibility and allows us to better control the improvement of yield and quality of the wafers.”

About STMicroelectronics

At ST, we are 46,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An independent device manufacturer, we work with more than 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology. Further information can be found at www.st.com.

Leave a Reply

featured blogs
Sep 20, 2021
The Cadence Scholarship Program is the flagship CSR program of Cadence India, introduced five years ago. Many meritorious students from under-served sections of society drop out of the education... [[ Click on the title to access the full blog on the Cadence Community site. ...
Sep 18, 2021
Projects with a steampunk look-and-feel incorporate retro-futuristic technology and aesthetics inspired by 19th-century industrial steam-powered machinery....
Sep 15, 2021
Learn how chiplets form the basis of multi-die HPC processor architectures, fueling modern HPC applications and scaling performance & power beyond Moore's Law. The post What's Driving the Demand for Chiplets? appeared first on From Silicon To Software....
Aug 5, 2021
Megh Computing's Video Analytics Solution (VAS) portfolio implements a flexible and scalable video analytics pipeline consisting of the following elements: Video Ingestion Video Transformation Object Detection and Inference Video Analytics Visualization   Because Megh's ...

featured video

Gesture Detection for Automotive In-Cabin Applications

Sponsored by Texas Instruments

See how using 60GHz radar for automotive in-cabin gesture is ideal due to its small size and ability to sense through various materials. Applications using gesture control include changing radio stations, answering phone calls, opening windows, and more.

Click to learn more about gesture detection using 60GHz mmWave radar sensors

featured paper

Keep the Lights On When Someone is Home

Sponsored by Maxim Integrated (now part of Analog Devices)

Find out how to keep the power on when the lights go out with a little help from Maxim.

Click to read more

featured chalk talk

NEUTRIK Fiber Optic Solutions

Sponsored by Mouser Electronics and Neutrik

The advantages and benefits of fiber optics are a mile long…but how can you design with them? How can you clean them? How do you repair them? Need a bit of a refresher? In this episode of Chalk Talk, Amelia Dalton chats with David Kuklinski from Neutrik about the OpticalCon advanced, OpticalCon LITE and Opticalcon DragonFly fiber optic solutions from Neutrik. They take a closer look at what benefits each of these solutions brings to the table, what kind of configurations are offered with each of these fiber optic solutions and what kind of performance you can expect when using them in your next design.

Click here for more information about Neutrik opticalCON® Fiber Optic Connector System