industry news
Subscribe Now

STMicroelectronics Expands Presence in Ultrasound Market with High-Performance 16-Channel Pulser

 

  • BCD8s-SOI technology assures high quality and performance at minimal Bill-of-Material costs
  • Chips uniquely integrate beamforming and, with 16 channels, a high-voltage stage, and internal memory, offer the flexibility to address multiple platforms
 
Geneva, August 6, 2018 — Targeting key medical and industrial applications, STMicroelectronics has launched a new high-voltage, compact, robust and cost-effective transmission pulser solution, built using ST’s proven BCD8s-SOI technology that supports analog (Bipolar), digital (CMOS), and power (DMOS) circuits on the same die.
The STHV1600 provides a valuable solution for high-end cart systems and ultra-portable ultrasound equipment, while reinforcing ST’s existing portfolio of 4- and 8-channel pulser transmitters for medical and industrial ultrasound applications. To assure the smallest size, the state-of-the-art STHV1600 transmission (TX) pulser integrates high-resolution beamforming for its 16 independent channels. Offering the capability to program code excitation allows users to implement high voltage stages and store the patterns in memory. For maximum flexibility, each channel can support up to five output levels and the output stages can provide up to ±2A peak output current, independent from the high-voltage power-supply pins.
The STHV1600 includes several global blocks including thermal protection for the logic and for each channel, under-voltage protection, and self-biased high-voltage MOSFET gate drivers with internal checks. Moreover, the IC includes 65 kbits of embedded memory to store pattern-control settings.
The STHV1600 (in a 144-ball 10×10 TFBGA) is in production and currently sampling to lead customers. An evaluation board for the STHV1600, STEVAL-IME014V1 is currently available to select customers. Please contact your ST sales office.

Leave a Reply

featured blogs
Feb 22, 2024
The new Cadence training website is online! This newly redesigned website provides an overview of our well-respected training methods and courses, plus offerings that might be new to you. Modern design and top-of-the-page navigation make it easy to find just what you need'”q...
Feb 15, 2024
This artist can paint not just with both hands, but also with both feet, and all at the same time!...

featured video

Tackling Challenges in 3DHI Microelectronics for Aerospace, Government, and Defense

Sponsored by Synopsys

Aerospace, Government, and Defense industry experts discuss the complexities of 3DHI for technological, manufacturing, & economic intricacies, as well as security, reliability, and safety challenges & solutions. Explore DARPA’s NGMM plan for the 3DHI R&D ecosystem.

Learn more about Synopsys Aerospace and Government Solutions

featured paper

Reduce 3D IC design complexity with early package assembly verification

Sponsored by Siemens Digital Industries Software

Uncover the unique challenges, along with the latest Calibre verification solutions, for 3D IC design in this new technical paper. As 2.5D and 3D ICs redefine the possibilities of semiconductor design, discover how Siemens is leading the way in verifying complex multi-dimensional systems, while shifting verification left to do so earlier in the design process.

Click here to read more

featured chalk talk

LEMBAS LTE/GNSS USB Modem from TE Connectivity
In today’s growing IoT design community, there is an increasing need for a smart connectivity system that helps both makers and enterprises get to market quickly. In this episode of Chalk Talk, Amelia Dalton chats with Jin Kim from TE Connectivity about TE’s LEMBAS LTE/GNSS USB Modem and how this plug-and-play solution can help jumpstart your next IoT design. They also explore the software, hardware, and data plan details of this solution and the design-in questions you should keep in mind when considering using the LEMBAS LTE/GNSS USB modem in your design.
Apr 20, 2023
35,672 views