industry news
Subscribe Now

SiFive Tapes Out First in a Series of 7nm IP Enablement Platforms

Includes critical IP validation for HBM2E 3.2Gbps Interface, TCAM and more

SAN MATEO, Calif.April 11, 2019 /PRNewswire/ — SiFive, the leading provider of commercial RISC-V processor IP and custom SoC solutions, today announced it has successfully taped out an IP enablement platform in 7nm FinFET technology that includes critical IP validation for SiFive’s high bandwidth memory (HBM2E) 3.2Gbps interface, 2GHz Ternary Content-Addressable Memory (TCAM) partner IP, a low-voltage differential signaling (LVDS) interface and other key IP building blocks. The high-speed IP interface enablement platform is the first in a series of SiFive’s next-generation platforms for high-performance and high-bandwidth applications. The forthcoming 7nm IP enablement platforms are:

  • HBM2E 2.5D ASIC SiP based on SiFive’s RISC-V Core IP with vector extension, TileLink – a high-performance, scalable, cache-coherent fabric; high-performance caches; HBM2E controller and PHY; support for low latency HBM memory; DMA and peripherals.
  • Customizable Freedom Revolution AI SoC platform based on SiFive’s 64-bit U7 and S7 Series RISC-V Multi-Core IP, TileLink, accelerator bays to connect a custom accelerator into the system, security IP, LPDDR5, an HBME controller and PHY, a PCIe5 SerDes and 56/112G SerDes.

“The design revolution taking place in the semiconductor industry has created unprecedented architectural freedom through customizable SoCs,” said Shafy Eltoukhy, senior vice president and general manager of the Custom SoC Business Unit at SiFive. “Our IP enablement platforms include internally developed IP along with the most robust, high-performance partner IP on the market for next-generation AI, networking and other high-performance applications in 7nm.”

About SiFive

SiFive is the leading provider of market-ready processor core IP, development tools and silicon solutions based on the free and open RISC-V instruction set architecture. Led by a team of seasoned silicon executives and the RISC-V inventors, SiFive helps SoC designers reduce time-to-market and realize cost savings with customized, open-architecture processor cores, and democratizes access to optimized silicon by enabling system designers in all market verticals to build customized RISC-V based semiconductors. Located in Silicon Valley, SiFive has backing from Sutter Hill Ventures, Spark Capital, Osage University Partners, Chengwei, Huami, SK Hynix, Intel Capital, and Western Digital. For more information, visit www.sifive.com.

Leave a Reply

featured blogs
Apr 25, 2024
Cadence's seven -year partnership with'¯ Team4Tech '¯has given our employees unique opportunities to harness the power of technology and engage in a three -month philanthropic project to improve the livelihood of communities in need. In Fall 2023, this partnership allowed C...
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

USB Power Delivery: Power for Portable (and Other) Products
Sponsored by Mouser Electronics and Bel
USB Type C power delivery was created to standardize medium and higher levels of power delivery but it also can support negotiations for multiple output voltage levels and is backward compatible with previous versions of USB. In this episode of Chalk Talk, Amelia Dalton and Bruce Rose from Bel/CUI Inc. explore the benefits of USB Type C power delivery, the specific communications protocol of USB Type C power delivery, and examine why USB Type C power supplies and connectors are the way of the future for consumer electronics.
Oct 2, 2023
26,045 views