industry news
Subscribe Now

Siemens collaborates with Intel Foundry to contribute 3D-IC technology leadership for Intel’s EMIB reference flow

Siemens Digital Industries Software today announced it has collaborated with Intel Foundry to develop a comprehensive workflow for the foundry’s embedded multi-die interconnect bridge (EMIB) approach to in-package, high-density interconnect of heterogeneous chips.

Leveraging the expertise and world class technology of Siemens’ industry leading IC and PCB design portfolios, Intel’s EMIB technology delivers advanced integrated IC packaging solutions that cover planning and prototyping, all the way to enabling signoff across a broad range of integration technologies including FCBGA, 2.5/3D IC, and others.

“We are providing our customers with highly innovative advanced packaging technology,” said Rahul Goyal, Vice President and General Manager, Product and Design Ecosystem, Intel Foundry. “Our collaboration with Siemens enables us to define a certified, production ready EMIB technology reference flow that we can deliver to our customers so that they can design efficiently and effectively.”

With this new Intel Foundry workflow, mutual customers can tackle a range of critical tasks including early package assembly prototyping, hierarchical device floorplanning, co-design optimization, verification of the complete detailed implementation, including signal and power integrity analysis, and Package Assembly Design Kit (PADK) driven assembly verification.

The Siemens technologies incorporated in this reference flow include Xpedition™ Substrate Integrator software, Xpedition™ Package Designer software, Hyperlynx™ software SI/PI and the Calibre® nmPlatform tool including Calibre® 3DSTACK software.

“Siemens is pleased to collaborate with Intel Foundry to develop and deliver a certified reference flow for Intel’s innovative EMIB technology,” said AJ Incorvaia, senior vice president, Electronic Board Systems, Siemens Digital Industries Software. “As a longtime supplier to Intel, Siemens is honored to be chosen for this project and looks forward to sharing our 3D-IC expertise for the benefit of our mutual customers.”

To learn more about Siemens EDA’s offerings in solutions to support 3D-IC design, visit: https://eda.sw.siemens.com/en-US/
Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens’ software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries, Siemens Digital Industries Software – Accelerating transformation.

Leave a Reply

featured blogs
Apr 19, 2024
In today's rapidly evolving digital landscape, staying at the cutting edge is crucial to success. For MaxLinear, bridging the gap between firmware and hardware development has been pivotal. All of the company's products solve critical communication and high-frequency analysis...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
Apr 18, 2024
See how Cisco accelerates library characterization and chip design with our cloud EDA tools, scaling access to SoC validation solutions and compute services.The post Cisco Accelerates Project Schedule by 66% Using Synopsys Cloud appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured chalk talk

Digi XBee 3 Global Cellular Solutions
Sponsored by Mouser Electronics and Digi
Adding cellular capabilities to your next design can be a complicated, time consuming process. In this episode of Chalk Talk, Amelia Dalton and Alec Jahnke from Digi chat about how Digi XBee Global Cellular Solutions can help you navigate the complexities of adding cellular connectivity to your next design. They investigate how the Digi XBee software can help you monitor and manage your connected devices and how the Digi Xbee 3 cellular ecosystem can help future proof your next design.
Nov 6, 2023
21,855 views