industry news
Subscribe Now

Siemens acquires UltraSoC to drive design for silicon lifecycle management

  • Acquisition expands Xcelerator portfolio and creates data-driven product lifecycle management solutions for system-on-chip (SoC)
  • Integration of cybersecurity, functional safety, and the management of complexity can enhance product quality, safety, and time-to-revenue across industries ranging from automotive and factory automation to high-performance computing

Siemens has signed an agreement to acquire Cambridge, UK-based UltraSoC Technologies Ltd., a provider of instrumentation and analytics solutions that put intelligent monitoring, cybersecurity and functional safety capabilities into the core hardware of system-on-chip (SoC). Siemens plans to integrate UltraSoC’s technology into the Xcelerator portfolio as part of Mentor’s Tessent™ software product suite. The addition of UltraSoC to Siemens enables a unified data-driven infrastructure that can enhance product quality, safety and cybersecurity, and the creation of a comprehensive solution to help semiconductor industry customers overcome key pain points including manufacturing defects, software and hardware bugs, device early-failure and wear-out, functional safety, and malicious attacks. 

“Siemens’ acquisition of UltraSoC means that for the first time our customers can access not just design-for-test, but a comprehensive ‘Design for Lifecycle Management’ solution for system-on-chips, including functional safety, security and optimization,” says Brady Benware, Tessent Vice President and General Manager, Siemens Digital Industries Software. “By utilizing design augmentation to detect, mitigate and eliminate risks throughout the SoC lifecycle, customers can radically improve time-to-revenue, product quality & safety, and profitability. UltraSoC has a fast-growing business and impressive customer list and, as part of Siemens, can complement Tessent to create a truly unique offering in the market.”

UltraSoC is a pioneer of embedding monitoring hardware into complex SoCs to enable “fab-to-field” analytics capabilities designed to accelerate silicon bring-up, optimize product performance, and confirm that devices are operating “as designed” for functional safety and cybersecurity purposes. Tessent is a market leader in SoC design-for-test (DFT) solutions, and has established strengths in the field of automotive functional safety via its Tessent Safety Ecosystem. These two highly complementary offerings are the foundation of a complete package of solutions, encompassing semiconductor design and production, functional safety, cybersecurity, and functional optimization of products in the field.

The combination of Siemens and UltraSoC technology can benefit the entire semiconductor product lifecycle, including structural, electrical, and functional capabilities of SoCs. It also supports Siemens’ comprehensive digital twin with UltraSoC providing monitoring of the real device.

“This acquisition accelerates UltraSoC’s vision at a much larger scale with the incredible team, assets, industry know-how and footprint of Siemens,” said Rupert Baines, CEO, UltraSoC. “Being part of one of the world’s foremost technology companies will allow UltraSoC to better serve our customers by accelerating R&D, leveraging a much larger pool of go-to-market resources, and an enormous global infrastructure. It has been clear since our initial meeting that UltraSoC and Siemens share a vision on how technology businesses can transform their operations end-to-end, from design conception to field deployment and we are excited to join the community.”

UltraSoC‘s products are widely used in the automotive, high-performance computing, storage and semiconductor industries. The company was recently selected as a participant in the DARPA AISS (Automatic Implementation of Secure Silicon) program; and is a member of the Secure-CAV consortium, an ambitious collaborative project that aims to improve the safety and security of tomorrow’s connected and autonomous vehicles (CAVs). Siemens’ acquisition of UltraSoC is due to close in the fourth quarter of Siemens’ fiscal year 2020. Terms of the transaction were not disclosed. 

Siemens Digital Industries Software is driving transformation to enable a digital enterprise where engineering, manufacturing and electronics design meet tomorrow. The Xcelerator portfolio helps companies of all sizes create and leverage digital twins that provide organizations with new insights, opportunities and levels of automation to drive innovation. For more information on Siemens Digital Industries Software products and services, visit www.sw.siemens.com or follow us on LinkedIn, Twitter, Facebook and Instagram. Siemens Digital Industries Software – Where today meets tomorrow.

For further information on Siemens’ SoC offerings, please see www.siemens.com/mentor

Leave a Reply

featured blogs
Jan 22, 2021
Amidst an ongoing worldwide pandemic, Samtec continues to connect with our communities. As a digital technology company, we understand the challenges and how uncertain times have been for everyone. In early 2020, Samtec Cares suspended its normal grant cycle and concentrated ...
Jan 22, 2021
I was recently introduced to the concept of a tray that quickly and easily attaches to your car'€™s steering wheel (not while you are driving, of course). What a good idea!...
Jan 22, 2021
This is my second post about this year's CES. The first was Consumer Electronics Show 2021: GM, Intel . AMD The second day of CES opened with Lisa Su, AMD's CEO, presenting. AMD announced new... [[ Click on the title to access the full blog on the Cadence Community...
Jan 20, 2021
Explore how EDA tools & proven IP accelerate the automotive design process and ensure compliance with Automotive Safety Integrity Levels & ISO requirements. The post How EDA Tools and IP Support Automotive Functional Safety Compliance appeared first on From Silicon...

featured paper

Common Design Pitfalls When Designing With Hall 2D Sensors And How To Avoid Them

Sponsored by Texas Instruments

This article discusses three widespread application issues in industrial and automotive end equipment – rotary encoding, in-plane magnetic sensing, and safety-critical – that can be solved more efficiently using devices with new features and higher performance. We will discuss in which end products these applications can be found and also provide a comparison with our traditional digital Hall-effect sensors showing how the new releases complement our existing portfolio.

Click here to download the whitepaper

Featured Chalk Talk

Accelerate the Integration of Power Conversion with microBUCK® and microBRICK™

Sponsored by Mouser Electronics and Vishay

In the world of power conversion, multi-chip packaging, thermal performance, and power density can make all of the difference in the success of your next design. In this episode of Chalk Talk, Amelia Dalton chats with Raymond Jiang about the trends and challenges in power delivery and how you can leverage the unique combination of discrete MOSFET design, IC expertise, and packaging capability of Vishay’s microBRICK™and microBUCK® integrated voltage regulators.

Click here for more information about Vishay microBUCK® and microBRICK™ DC/DC Regulators