industry news
Subscribe Now

Sequans Introduces Calliope 2: A New Generation of LTE Cat 1 Technology for IoT Applications Requiring Higher Than LTE-M Speed

  • Ideal for wireless headphones and speakers, wearables, connected cameras, smart city and alarm applications
  • Advanced chipset integration significantly lowers Cat 1 module cost
  • Enables low power consumer apps with integrated voice support
  • Flexible SIM management for ieUICC, eUICC or legacy UICC

PARIS, France – January 6, 2021 – Sequans Communications S.A. (NYSE: SQNS) today announced that its second-generation LTE Cat 1 chip platform, Calliope 2, will soon be sampling. Calliope 2 is designed for the cost-effective support of IoT applications that require VoLTE and a data rate higher than 100 kilobits per second that cannot be supported by LTE-M or NB-IoT technologies.  Typical Calliope 2 applications include wearables and hearables with music streaming and voice support, and smart city/smart home IoT devices such as security cameras, alarm panels, and utility meters, needing high throughput, and data aggregators where speed of up to several megabits per second may be required.

Advancements in Sequans Calliope 2 technology remove the cost and power consumption barriers that have thus far inhibited widespread deployment of Cat 1 for IoT. These advancements include: 1) higher integration that has lowered the Cat 1 module cost closer to the level of LTE-M module cost, and 2) significantly improved power consumption, in both active and low power modes, lowering the power profile close to the LTE-M power profile, and thereby significantly extending the battery life of Cat 1 IoT devices.

“Calliope 2 is a truly universal and highly effective IoT solution and we are excited about the many new IoT applications that are being built because of it,” said Georges Karam, Sequans CEO. “Calliope 2 complements our Monarch 2 LTE-M/NB-IoT product family and makes Sequans a one-stop shop for virtually all IoT applications—ranging from simple low speed sensor devices to higher speed security cameras, and from low-power, battery-operated consumer devices to sophisticated, higher speed industrial devices.”

In addition to cost and power improvements, Calliope 2 delivers advanced features such as an EAL5+ secure enclave for ieUICC, and integrated VoLTE with support for emergency voice calling and streaming audio.

Calliope 2 is 5G-ready, compliant with the 3GPP Release 15 massive IoT standard. Its user application software and interfaces are compatible with Sequans’ Monarch 2 LTE-M/NB-IoT platform, allowing easy migration among Cat 1, LTE-M, and NB-IoT massive IoT technologies. Cat 1 networks are today available worldwide, enabling Calliope 2 to support any IoT application or device, even in those regions where LTE-M is not yet available.

Calliope 2 Feature Highlights

  • 3GPP Release 15
  • Up to 10 Mbps DL, and 5 Mbps UL
  • Interfaces include USB 2.0, 4xHS-UART, SPI, PCM/I2S
  • Advanced low power features eDRX and PSM with rock bottom at 1µA
  • Comprehensive VoLTE voice engine including HD-quality voice (EVS)
  • Baseband, RF, power management and memory integrated in one chip platform
  • Compatible with Sequans Monarch 2 LTE-M/NB-IoT platform for easy migration among Cat 1, Cat M, Cat NB1/NB2
  • EAL5+ security for iSIM
  • Streaming audio

“Sequans pioneered Cat 1 technology for IoT and has always recognized its value,” said Karam.  “We are the only cellular IoT chipmaker with a strategic product roadmap for Cat 1, and we have designed our Calliope 2 platform to be scalable and in sync with the sunsetting of 2G and 3G networks, thereby answering a key industry demand at just the right time. There are real and valuable opportunities in Cat 1 for IoT, complementing LTE-M/NB-IoT, and Calliope 2 is the ideal starting point.”

See Sequans online next week at CES 2021, January 11-14. For more information or to schedule a meeting, contact events@sequans.com.

About Sequans

Sequans Communications S.A. (NYSE: SQNS) is a leading developer and provider of 5G and 4G chips and modules for massive, broadband, and critical IoT. For 5G/4G massive IoT applications, Sequans provides a comprehensive product portfolio based on its flagship Monarch LTE-M/NB-IoT and Calliope Cat 1 chip platforms, featuring industry-leading low power consumption, a large set of integrated functionalities, and global deployment capability. For 5G/4G broadband and critical IoT applications, Sequans offers a product portfolio based on its Cassiopeia Cat 4/Cat 6 4G and high-end Taurus 5G chip platforms, optimized for low-cost residential, enterprise, and industrial applications. Founded in 2003, Sequans is based in Paris, France with additional offices in the United States, United Kingdom, Israel, Finland, Hong Kong, Singapore, Taiwan, South Korea, and China. Visit Sequans online at www.sequans.com.

2 thoughts on “Sequans Introduces Calliope 2: A New Generation of LTE Cat 1 Technology for IoT Applications Requiring Higher Than LTE-M Speed”

Leave a Reply

featured blogs
Mar 4, 2024
The current level of computing power is unprecedented. It has led to the development of advanced computational techniques that enable us to simulate larger systems and predict complex phenomena with greater accuracy. However, the simulation of turbomachinery systems still pos...
Mar 1, 2024
Explore standards development and functional safety requirements with Jyotika Athavale, IEEE senior member and Senior Director of Silicon Lifecycle Management.The post Q&A With Jyotika Athavale, IEEE Champion, on Advancing Standards Development Worldwide appeared first ...
Feb 28, 2024
Would it be better to ride the railways on people-powered rail bikes, or travel to the edge of space in a luxury lounge hoisted by a gigantic balloon?...

featured video

Tackling Challenges in 3DHI Microelectronics for Aerospace, Government, and Defense

Sponsored by Synopsys

Aerospace, Government, and Defense industry experts discuss the complexities of 3DHI for technological, manufacturing, & economic intricacies, as well as security, reliability, and safety challenges & solutions. Explore DARPA’s NGMM plan for the 3DHI R&D ecosystem.

Learn more about Synopsys Aerospace and Government Solutions

featured paper

Reduce 3D IC design complexity with early package assembly verification

Sponsored by Siemens Digital Industries Software

Uncover the unique challenges, along with the latest Calibre verification solutions, for 3D IC design in this new technical paper. As 2.5D and 3D ICs redefine the possibilities of semiconductor design, discover how Siemens is leading the way in verifying complex multi-dimensional systems, while shifting verification left to do so earlier in the design process.

Click here to read more

featured chalk talk

Littelfuse Protection IC (eFuse)
If you are working on an industrial, consumer, or telecom design, protection ICs can offer a variety of valuable benefits including reverse current protection, over temperature protection, short circuit protection, and a whole lot more. In this episode of Chalk Talk, Amelia Dalton and Pete Pytlik from Littelfuse explore the key features of protection ICs, how protection ICs compare to conventional discrete component solutions, and how you can take advantage of Littelfuse protection ICs in your next design.
May 8, 2023
36,311 views