DRESDEN, Germany — April 30, 2025 — Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden. The Summit will offer insights into the latest heterogeneous integration innovations that are strengthening Europe’s semiconductor resilience and powering the next generation of intelligent systems. Registration is open.
Themed Heterogenous Integration: Bolstering Europe’s Resilience, this year’s Summit will feature an expanded program covering geopolitical dynamics, market trends, chiplet design, as well as the latest advancements in chiplet applications and hybrid bonding techniques.
“We look forward to welcoming industry leaders, innovators, and researchers to showcase their latest technologies and developments at the 3D & Systems Summit,” said Laith Altimime, President of SEMI Europe. “As Europe advances in chiplet architectures, hybrid bonding, and co-packaged optics, the Summit provides a unique platform to drive collaboration and highlight the innovations shaping the future of semiconductors.”
3D & Systems Summit Sessions
NextGen Talent: Empowering Careers, Driving Growth
Featuring insights from semiconductor leaders, educators, and students, this session will highlight best practices for attracting, developing, and retraining top talent. Experts will discuss strategies that foster innovation, bridge talent gap, and create meaningful career opportunities—key to securing Europe’s continued leadership in the semiconductor industry.
Session 1: Geopolitical Dynamics and Market Trends
Executive leaders will examine how geopolitical dynamics are reshaping the semiconductor industry, highlighting Europe’s strategic role amid global demand shifts and supply chain disruptions.
Session 2: Chiplet Applications: System Level Architectures
Industry experts will explore the diverse applications of chiplet technology in various fields, highlighting the conceptual aspects of design and 3D integration.
Session 3: Hybrid Bonding – Die to Wafer
Specialists will focus on die-to-wafer hybrid bonding and its role in enabling advanced 3D integration, with insights into scalability, cost-effectiveness, and the roadmap for industry adoption.
Session 4: Hybrid Bonding – Wafer to Wafer
Experts will discuss wafer-to-wafer hybrid bonding technologies and examine the current state of these technologies as well as the technical and market challenges they face.
Session 5: Photonics and Co-Package Optics
Industry leaders will share insights into the integration of photonics and co-package optics, and how these advancements can drive innovation and efficiency across diverse industries.
Session 6: European Readiness: Design, Materials, Manufacturing
Visionaries will explore the design, materials, and manufacturing scalability of technologies, highlighting key challenges, cost-effective factors, and innovative solutions for advancing 3D integrated circuits and chiplet production.
Global Leaders to Present
3D & Systems Summit presenters include experts from these global leaders:
- Adeia
- ASML
- Besi
- Bosch
- CEA-Leti
- Confovis
- ETEL S.A.
- European Semiconductor Manufacturing Company (ESMC)
- EV Group
- Fraunhofer
- imec
- Infinitesima
- Intel
- KLA
- Lam Research
- NXP Semiconductors
- RANOVUS
- SUSS MicroTec
- TechSearch International
- Yole Group
Exhibition and Business Networking
The 3D & Systems Summit will also feature business-to-business matchmaking and networking for participants to explore new partnerships and other business opportunities.
To reserve an exhibition space, contact euevents@semi.org.
This year’s networking reception will take place at the Hilton Dresden on the first day of the event, and the annual networking dinner will be held on the Elbe River cruise.
Networking dinner registration is reserved exclusively for 3D & Systems Summit 2025 participants. Guests may register their spouse for dinner through the registration link.
3D Summit premium sponsors: Adeia, ASE, Comet, Confovis, CTP, EV Group, HEIDENHAIN, imec, Lam Research, MKS Atotech
For more details, please visit the 3D & Systems Summit 2025 website and connect with SEMI Europe on LinkedIn or YouTube @SEMIEurope (#3DSummit).
About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.
