industry news
Subscribe Now

Samtec Releases 2.40 mm Compression Mount Connector

New Albany, IN: Samtec announces release of their new 2.40 mm Compression Mount Connector designed to perform to 50 GHz. Primarily for use in the high-speed digital test market this connector is designed for stripline applications. The connector is vertically mounted to the PCB and attached in place by two 0-80 UNF screws eliminating the need for soldering to the test points. Microstrip design in development.

About Samtec, Inc.:
Founded in 1976, Samtec is a privately held, $800MM global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 40+ international locations and products sold in more than 125 different countries, Samtec’s global presence enables its unmatched customer service. For more information, please visit http://www.samtec.com.

Leave a Reply

featured blogs
Apr 23, 2024
Do you think you are spending too much time fine-tuning your SKILL code? As a SKILL coder, you must be aware that producing bug-free and efficient code requires a lot of effort and analysis. But don't worry, there's good news! The Cadence Virtuoso Studio platform ha...
Apr 23, 2024
We explore Aerospace and Government (A&G) chip design and explain how Silicon Lifecycle Management (SLM) ensures semiconductor reliability for A&G applications.The post SLM Solutions for Mission-Critical Aerospace and Government Chip Designs appeared first on Chip ...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured chalk talk

PIC® and AVR® Microcontrollers Enable Low-Power Applications
Sponsored by Mouser Electronics and Microchip
In this episode of Chalk Talk, Amelia Dalton and Marc McComb from Microchip explore how Microchip’s PIC® and AVR® MCUs are a game changer when it comes to low power embedded designs. They investigate the benefits that the flexible signal routing, core independent peripherals, and Analog Peripheral Manager (APM) bring to modern embedded designs and how these microcontroller families can help you avoid a variety of pitfalls in your next design.
Jan 15, 2024
14,011 views